Aachen/Germany, December 11, 2012 - AIXTRON SE, a leading provider of deposition equipment to the semiconductor industry, today announced that the company's advanced ALD product QXP-8300 has now been qualified by a major Korean DRAM manufacturer for advanced high volume memory manufacturing.

Dr. Bernd Schulte, Executive Vice President and Chief Operating Officer at AIXTRON, comments, "I am pleased to announce another major milestone for our QXP-8300 ALD technology and we are delighted that such a prominent DRAM manufacturer has qualified the QXP-8300 for their critical ALD technology production needs. The QXP-8300 offers best-in-class productivity and this qualification within just 3 months validates our confidence and ability to meet critical customer production ramp demand."

"Interest in our Silicon systems has greatly increased since we released the QXP-8300," Dr. Sasangan Ramanathan, Chief Technical Officer at AIXTRON Inc., adds, "and we foresee further significant growth opportunities for high throughput ALD technology with this product."

AIXTRON's Atomic Layer Deposition technology enables the production of ultra thin films for both semiconductor and new, emerging non-semiconductor device applications. The system demonstrates excellent film uniformity and repeatability with high throughput capabilities. AIXTRON announced the multi-tool order from Korea for its QXP-8300 ALD system in July 2012.
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