Amkor Technology, Inc. : Amkor Technology Appoints New President of Amkor Technology Taiwan
03/15/2012| 03:30pm US/Eastern
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of
semiconductor packaging and test services, today announced that Mike
Liang has joined the company as President of Amkor Technology Taiwan.
Liang and his team are responsible for servicing our packaging and test
customers and executing our strategies in Taiwan.
"Mike Liang is a seasoned manufacturing executive with a proven track
record in operations, sales and marketing for semiconductor packaging,
wafer processing and testing services," said JooHo Kim, Amkor's
executive vice president, worldwide manufacturing operations. "Mike's
extensive industry experience and proven leadership skills are a great
fit for our manufacturing team."
Liang joins Amkor Technology Taiwan from King Yuan Electronics
Corporation in Hsin-Chu, Taiwan, where he most recently served as
president and chief executive officer. Prior to King Yuan Electronics
Corporation, Liang held various executive and operational roles at
Phoenix Semiconductor International, AbelLink Technology, Mosel-Vitelix,
Ti-Acer, and United Microelectronics Corporation. Liang holds a Bachelor
of Science in physics from National Cheng Kung University and an MBA
from National Taiwan University.
Amkor is a leading provider of semiconductor packaging and test services
to semiconductor companies and electronics OEMs. More information on
Amkor is available from the company's Securities and Exchange Commission
(the "SEC") filings and on Amkor's website: www.amkor.com.
Amkor Technology, Inc.
Sr. Director, Corporate
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