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Semiconductor Packaging and Assembly Equipment Market Is Set to Boom by 2023

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09/04/2017 | 08:02pm CEST

Semiconductor Packaging and Assembly Equipment Market Size is Set to Grow at a Remarkable Pace in the Coming Years.Portland, OR -- (SBWIRE) -- 09/04/2017 -- Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.Access full summary at:
https://www.alliedmarketresearch.com/semiconductor-packaging-and-assembly-equipment-marketThe increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.Major companies profiled in the report include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group.Semiconductor Packaging and Assembly Equipment Market Key Segmentation:
By Type
- Plating Equipment
- Inspection and Dicing Equipment
- Wire Bonding Equipment
- Die-Bonding Equipment
- Inspection and Dicing EquipmentBy Application
- Consumer Electronics
- Healthcare Devices
- Automotive Application
- Enterprise Storage
- Industrial Applications
- OthersBy Region
- North America
o U.S.
o Mexico
o Canada- Europe
o UK
o Germany
o France
o Rest of Europe- Asia-Pacific
o China
o Japan
o India
o Rest of Asia-Pacific- LAMEA
o Latin America
o Middle East
o AfricaKey Players
- Amkor Technology Inc.
- Fujitsu Ltd.
- Toshiba Corporation
- Qualcomm Incorporated
- Renesas Electronics Corporation
- Samsung Electronics Co Ltd.
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- ChipMOS Technologies Inc.
- Powertech Technologies Inc.
- ASE GroupRequest TOC and Sample Report:
https://www.alliedmarketresearch.com/request-toc-and-sample/3108About Allied Market Research
Allied Market Research is a Market Research Company which offers Syndicate & Custom Market Research Reports with Consulting Services.Contact Us:
5933 NE Win Sivers Drive,
#205, Portland, OR 97220,
United States.
Int'l: +1-503-894-6022
Toll Free: +1-800-792-5285
Fax: +1-800-792-5285
[email protected] more information on this press release visit: http://www.sbwire.com/press-releases/semiconductor-packaging-and-assembly-equipment-market-is-set-to-boom-by-2023-854846.htm

Media Relations Contact

Allied Market Research
Telephone: 800-792-5285
Email: Click to Email Allied Market Research
Web: https://www.alliedmarketresearch.com/industrial-wireless-sensor-network-market

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Financials ($)
Sales 2017 4 080 M
EBIT 2017 274 M
Net income 2017 291 M
Debt 2017 781 M
Yield 2017 -
P/E ratio 2017 9,54
P/E ratio 2018 13,15
EV / Sales 2017 0,78x
EV / Sales 2018 0,68x
Capitalization 2 407 M
Duration : Period :
Amkor Technology, Inc. Technical Analysis Chart | AMKR | US0316521006 | 4-Traders
Technical analysis trends AMKOR TECHNOLOGY, INC.
Short TermMid-TermLong Term
Income Statement Evolution
Mean consensus UNDERPERFORM
Number of Analysts 3
Average target price 9,92 $
Spread / Average Target -1,4%
EPS Revisions
Stephen Douglas Kelley President, Chief Executive Officer & Director
James Joo-Jin Kim Executive Chairman
Megan Faust Chief Financial Officer & Vice President
James W. Zug Independent Director
John T. Kim Executive Vice Chairman
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