Log in
E-mail
Password
Remember
Forgot password ?
Become a member for free
Sign up
Sign up
Settings
Settings
Dynamic quotes 
OFFON

4-Traders Homepage  >  Equities  >  Nasdaq  >  Applied Materials, Inc.    AMAT

SummaryQuotesChartsNewsAnalysisCalendarCompanyFinancialsConsensusRevisions 
News SummaryMost relevantAll newsSector newsTweets 

APPLIED MATERIALS : Speeds Chip Interconnects with High-Performance, Power-Efficient, Low-k Technology

share with twitter share with LinkedIn share with facebook
share via e-mail
0
07/12/2011 | 01:35pm CEST
  • Mobility era demands lower power, faster microprocessor and graphics chips
  • Nearly one-third of microprocessor power is consumed by the interconnects
  • Challenge: Providing a low resistance, mechanically strong, dielectric film for high chip yield
  • Solution: Applied's third-generation ultra-low-k film and UV curing technologies

SANTA CLARA, Calif., July 12, 2011 - Applied Materials, Inc. today introduced its latest technology for building fast, low power interconnects in logic devices at the 22nm node and below with the Applied Producer® Black DiamondTM 3:
http://www.appliedmaterials.com/technologies/library/producer-black-diamond-pecvd deposition system and Applied Producer® NanocureTM 3:
http://www.appliedmaterials.com/technologies/library/producer-nanocure-3-uv-cure UV curing system. Together, these systems create the critical low-k dielectric:
http://www.appliedmaterials.com/news/media-resources/technical-glossary#DIELECTRIC films that insulate miles of copper wiring that connect a chip's transistors to each other and to the outside world enabling higher speed, more power-efficient smartphones, tablets and PCs.

"Our new Black Diamond 3 technology is extendible to the 14nm design node and below and will enable the fabrication of the next several generations of smaller, higher performance and more power-efficient devices," said Bill McClintock, vice president and general manager of Applied's Dielectric Systems and Modules business unit. "Our customers are very excited about this new low-k solution since it can be smoothly integrated into their existing process flows and has the superior mechanical strength needed to withstand the rigorous packaging process to enable higher device yields:
http://www.appliedmaterials.com/news/media-resources/technical-glossary#YIELD."

Designed at the molecular level with a proprietary chemistry, Applied's Black Diamond 3 process creates a dielectric film with uniform porosity. This engineered nano-porosity greatly increases the mechanical strength and hardness of the film - enabling it to withstand the stress of hundreds of downstream processes and packaging:
http://www.appliedmaterials.com/technologies/semiconductor/wafer-level-packaging steps. The new film also delivers an industry-leading k-value:
http://www.appliedmaterials.com/news/media-resources/technical-glossary#k-VALUE of 2.2, which reduces unwanted, or parasitic, capacitance in interconnects and allows chipmakers to boost the electrical performance of their devices. A lower k-value also helps to reduce switching power losses for optimizing battery life and reducing heat build-up, which are critical for power-efficient mobile devices.

The new Applied Producer Nanocure 3 system enhances Applied's industry-leading ultraviolet (UV) curing technology for porous low-k films with advancements in UV source optics and chamber design that provide up to 50% more uniform curing than conventional processes. The Nanocure 3 employs a high intensity UV source with a low pressure curing process that results in 40% faster curing. Combined with the Black Diamond 3 film, this two-step deposition and cure process provides up to twice the mechanical strength of Applied's successful second generation Black Diamond film, reducing device variability and boosting chip yield.

"Applied's Black Diamond technology was introduced for the 90nm technology node and has remained the industry standard for low-k films for more than a decade due to our continuous innovation in significantly improving dielectric film strength while simultaneously reducing its k-value," said Dr. Randhir Thakur, executive vice president and general manager of the Silicon Systems Group at Applied Materials. "We are pleased that our interconnect solutions:
http://www.appliedmaterials.com/interconnects are helping the industry keep pace with the relentless drive for greater power efficiency and speed."

Applied Materials will showcase the breakthrough Black Diamond 3 and Nanocure 3 technologies at Semicon West in San Francisco from July 12-14. For more information, visit www.appliedmaterials.com/events/semicon-west-2011:
http://www.appliedmaterials.com/events/semicon-west-2011.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. At Applied Materials, we turn today's innovations into the industries of tomorrow. Learn more at www.appliedmaterials.com:
http://www.appliedmaterials.com/.

# # #

Contact:
Connie Duncan:
mailto:[email protected]?subject=Press%20Release (editorial/media) 408.563.6209
Michael Sullivan:
mailto:[email protected]?subject=Press%20Release (financial community) 408.986.7977

Applied?s third-generation ultra-low-k film and UV curing technologies:
http://hugin.info/143724/R/1530244/465506.jpg



This announcement is distributed by Thomson Reuters on behalf of Thomson Reuters clients.

The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and other applicable laws; and
(ii) they are solely responsible for the content, accuracy and originality of the
information contained therein.

Source: Applied Materials via Thomson Reuters ONE

HUG#1530244
share with twitter share with LinkedIn share with facebook
share via e-mail
0
Latest news on APPLIED MATERIALS, INC.
04/21 U.S. and Indonesia seek to cut trade and investment barriers
04/21 U.S. and Indonesia seek to cut trade and investment barriers
04/20 APPLIED MATERIALS : Patent Issued for Apparatus and Methods for Injector to Subs..
04/20 DOW CHEMICAL : New Findings from Dow Chemical Company in the Area of Applied Mat..
04/20 APPLIED MATERIALS : Patent Issued for Sputter Source for Semiconductor Process C..
04/20 APPLIED MATERIALS : ACS Applied Materials & Interfaces Issues 93 Research Articl..
04/13 APPLIED MATERIALS : ACS Applied Materials & Interfaces Issues 81 Research Articl..
04/07 APPLIED MATERIALS : Patent Issued for Electrostatic Chuck (USPTO 9608549)
04/07 APPLIED MATERIALS : The Cohen Lawrence B Sells 21,708 Shares of Applied Material..
04/07 APPLIED MATERIALS : Patent Issued for Physical Vapor Deposition RF Plasma Shield..
More news
Sector news : Semiconductor Machinery Manufacturing
03/31 Investors bet on a quiet tech revolution in Europe
03/08 ASML : Credit Suisse executive investigated for suspected insider trading in Tai..
01/18 European shares retreat as Pearson plummets
2016DJASML CEO : Consolidation Has Run Its Course in Semiconductor Sector
2016DJASML : to Buy 24.9% Stake in Carl Zeiss SMT for EUR1 Billion in Cash
More sector news : Semiconductor Machinery Manufacturing
News from SeekingAlpha
04/19 Stellar Lam Research quarter helping lift chip equipment stocks
04/18 What Taiwan Semiconductor And Intel Tell Us About Applied Materials
04/13 ORBOTECH : A Great Company Positioned For Emerging Technologies
04/12 3 Tech Stocks To Buy On This Pullback
04/10 GOLDMAN : 21 stocks seen lifting margins
Advertisement
Financials ($)
Sales 2017 13 220 M
EBIT 2017 3 337 M
Net income 2017 2 722 M
Finance 2017 2 134 M
Yield 2017 1,04%
P/E ratio 2017 15,92
P/E ratio 2018 14,64
EV / Sales 2017 3,09x
EV / Sales 2018 2,83x
Capitalization 42 966 M
More Financials
Chart APPLIED MATERIALS, INC.
Duration : Period :
Applied Materials, Inc. Technical Analysis Chart | AMAT | US0382221051 | 4-Traders
Full-screen chart
Technical analysis trends APPLIED MATERIALS...
Short TermMid-TermLong Term
TrendsBullishBullishBullish
Technical analysis
Income Statement Evolution
More Financials
Consensus
Sell
Buy
Mean consensus OUTPERFORM
Number of Analysts 23
Average target price 41,2 $
Spread / Average Target 3,4%
Consensus details
EPS Revisions
More Estimates Revisions
Managers
NameTitle
Gary E. Dickerson President, Chief Executive Officer & Director
Thomas J. Iannotti Chairman
Robert J. Halliday Chief Financial Officer & Senior Vice President
Omkaram Nalamasu Chief Technology Officer & Senior Vice President
Jay O. Kerley Chief Information Officer & Group Vice President
More about the company
Sector and Competitors
1st jan.Capitalization (M$)
APPLIED MATERIALS, INC..23.30%42 966
DISCO CORPORATION20.00%5 581
ASM INTERNATIONAL26.21%3 682
BE SEMICONDUCTOR31.02%1 780
BEIJING JINGYUNTONG TE..-14.04%1 775
NAURA TECHNOLOGY GROUP..--.--%1 648
More Results