Asahi Glass : AGC Succeeds in Developing Micro Hole Drilling Processing Technology for Ultra-thin Glass with a Thickness in the Order of Microns - Toward Application for Laminated Semiconductor Components -
03/05/2012| 03:52am US/Eastern
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Tokyo, March 5, 2012-AGC (Asahi Glass Co., Ltd.; Head
Office: Tokyo; President & CEO: Kazuhiko Ishimura) has
succeeded in developing ultra-high speed processing
technology for micro hole drilling processing of ultra-thin
glass with a thickness of 0.1 millimeter. The combination of
this micro hole drilling processing technology and the
production technology for ultra-thin glass has opened the
door for glass to be used in
leading-edge applications such as laminated
semiconductors.
Ultra-thin glass has prospects for being applied to various
products thanks to its thinness of 0.1mm in addition to the
excellent features of glass including transparency, heat
resistance and electrical insulation. Last year, AGC
developed the world's thinnest float glass, with a thickness
of just 0.1 millimeters. Meanwhile, however, it was difficult
to process such thin sheet glass using ordinary processing
methods, which made it necessary to develop new technologies
to commercialize ultra-thin glass.
Recently, AGC has developed a micro hole drilling processing
technology using a dielectric breakdown induced by electrical
discharging. This technology has enabled precise drilling
processing on ultra-thin glass with a very high processing
speed, in the order of a few milliseconds.
This technology can be applied, for instance, to hole
drilling processing of thin sheet glass for interposers for
laminated semiconductors. Laminated semiconductors are
produced by vertically stacking semiconductor chips for
enhanced performance, and are connected to a printed circuit
board via an interposer. This interposer needs many holes
with a diameter of about 50
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