ASML HOLDING : TSMC joins ASML's Customer Co-Investment Program for innovation
08/05/2012| 08:05am US/Eastern

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ASML Holding NV announces today that TSMC has joined its Customer
Co-Investment Program for innovation, committing to invest EUR 276
million in research and development of next generation lithography
technologies, which include Extreme Ultraviolet (EUV) lithography
technology and 450-millimeter lithography tools, over the next five
years as well as EUR 838 million in a 5 percent ASML equity stake.
The objective of the Co-Investment Program, which was announced on July
9, 2012, is to accelerate ASML's development of EUV technology beyond
this current generation and ASML's development of future 450 mm silicon
wafer technology, both due in the second half of this decade.
"One of the biggest challenges facing IC scaling today is how to
effectively control the escalating wafer manufacturing cost," said
Shang-yi Chiang, TSMC executive vice president and co-chief operating
officer. "We are confident that the additional funding for ASML's
research and development programs will help secure and accelerate EUV
development activities, in parallel with the necessary focus on improved
performance of existing optical lithography tools and speed up the
deployment of new technologies for 450 millimeter wafers. This effort
will help the industry control wafer cost, and therefore protect the
economic viability of Moore's Law."
"We welcome TSMC to our Customer Co-Investment Program. The objective of
the Co-Investment program is to secure and accelerate key lithography
technologies. These technologies will benefit the entire industry and
are not restricted to our Co-Investment partners," said Eric Meurice,
Chief Executive Officer of ASML.
As part of ASML's Customer Co-Investment Program, ASML may issue up to
an aggregate 25 percent minority equity stake to customers. The entire
cash proceeds from the share issuance will be returned to ASML
shareholders (not including participating customers) through a synthetic
buy-back. With Intel and TSMC now committing to the Co-Investment
Program, 20% equity has been committed. The remaining 5% equity holding
potential is being discussed with other customers. The shares to be
issued to TSMC, Intel and any other customers that participate in the
Co-Investment Program will be non-voting except in exceptional
circumstances.
As announced on 9 July 2012, ASML can issue new shares equivalent to
9.99% of ASML's issued share capital to Intel as per the decisions made
at ASML's 2012 Annual General Meeting of shareholders. The issuance of
further shares in the Co-Investment Program to both Intel and TSMC (and
any additional customers who may participate in the Co-Investment
Program) as well as the synthetic buyback are subject to shareholder
approval at the extraordinary meeting of shareholders scheduled for
September 7, 2012.
Further information on the Co-Investment Program, including conditions
of regulatory and shareholder approval, can be found on ASML's website
at www.asml.com/egm2012
and www.asml.com/press
About ASML
ASML is one of the world's leading providers of lithography systems for
the semiconductor industry, manufacturing complex machines that are
critical to the production of integrated circuits or chips.
Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext
Amsterdam and NASDAQ under the symbol ASML. ASML has almost 8,000
employees on payroll (expressed in full time equivalents), serving chip
manufacturers in more than 55 locations in 16 countries. More
information about our company, our products and technology, and career
opportunities is available on our website: www.asml.com
Forward Looking Statements
"Safe Harbor" Statement under the US Private Securities Litigation
Reform Act of 1995: the matters discussed in this document may include
forward-looking statements, including statements made about our outlook,
including expected sales trends, expected shipments of tools,
productivity of our tools, purchase commitments, IC unit demand,
financial results, expected gross margin and expenses, statements about
our co-investment program including potential funding commitments in
connection with that program and statements about our buy-back program.
These forward looking statements are subject to risks and uncertainties
including, but not limited to: economic conditions, product demand and
semiconductor equipment industry capacity, worldwide demand and
manufacturing capacity utilization for semiconductors (the principal
product of our customer base), including the impact of general economic
conditions on consumer confidence and demand for our customers'
products, competitive products and pricing, the impact of manufacturing
efficiencies and capacity constraints, the continuing success of
technology advances and the related pace of new product development and
customer acceptance of new products, our ability to enforce patents and
protect intellectual property rights, the risk of intellectual property
litigation, availability of raw materials and critical manufacturing
equipment, trade environment, changes in exchange rates, available cash,
distributable reserves for dividend payments and share repurchases,
risks associated with our co-investment program, including whether
shareholder approval of the issuance of shares in excess of 10% of our
share capital and the synthetic buyback at the EGM will be obtained,
receipt of regulatory approvals, whether other customers will
participate in the program, whether the 450mm and EUV research and
development programs will be successful, ASML's ability to hire
additional workers as part of the 450mm and EUV programs described in
this release and other risks indicated in the risk factors included in
ASML's Annual Report on Form 20-F and other filings with the US
Securities and Exchange Commission.
The securities of ASML referred to in this press release have not been
registered under the United States Securities Act of 1933 and may not be
offered or sold absent registration or in a transaction exempt from or
not subject to the registration requirements of that act.

ASML Holding NV
Media Relations Contacts
Lucas van Grinsven -
Communications - +31 40 268 3949 - Veldhoven, the Netherlands
Emily
Leung - Communications - +852 (2162) 9037 - Hong Kong, China
Ryan
Young ? Communications - +1 480 383 4733 - Tempe, Arizona, USA
or
Investor
Relations Contacts
Craig DeYoung - Investor Relations - +1 480 383
4005 - Tempe, Arizona, USA
Rob van Vliet - Investor Relations - +31
40 268 3128 - Veldhoven, the Netherlands
© Business Wire 2012
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