Produces and supplies semiconductor assembly equipment for the global semiconductor and electronics industries
BE Semiconductor Industries NV is engaged in the business of development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries.
The company supplies semiconductor assembly equipment through its four product groups: Die Attach, Wire Bonding, Packaging and Plating.
The Die Attach Equipment product group produces single chip, multi chip, multi module and flip chip die bonding systems and die sorting systems.
The Wire Bonding Equipment product group delivers systems utilizing gold and copper wire for sale in combination with its die attach systems.
The Packaging Equipment product group produces molding, trim & form and singulation systems.
The Plating Equipment product group produces tin, copper and precious metal plating systems.
The company distributes its products to a wide range of end-use markets such as electronics, computer, automotive, industrial, RFID, LED and solar energy.
BE Semiconductor Industries was founded in May 1995 and is headquartered in Duiven, Netherlands.