Duiven, the Netherlands, April 24, 2013 - BE Semiconductor Industries N.V. ("the Company" or "Besi") (NYSE Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the first quarter ended March 31, 2013.

Key Highlights
  • Revenue of € 64.0 million up 13.7% vs. Q4-12 and 14.8% vs. Q1-12. Above guidance due primarily to strength in epoxy and flip chip die attach systems for smart phone and tablet applications
  • Orders increased to € 63.9 million (+22.8% vs. Q4-12) due primarily to increased demand for epoxy, flip chip and multi module die attach systems for smart phone and tablet applications. Down 24.2% vs. Q1-12
  • Gross margins rose to 39.6% from 36.4% in Q4-12 (37.7% ex restructuring) due to higher volume, favorable customer and product mix and lower European production overhead. Above guidance. Up vs. 39.4% in Q1-12
  • Pre-tax income increased to € 4.9 million in Q1-13. Up € 7.5 million vs. Q4-12 and € 3.4 million vs. Q1-12
  • Net income grew to € 3.8 million in Q1-13 vs. € 1.2 million in Q4-12 and € 0.2 million in Q1-12
Outlook
  • Approximately 10% sequential revenue growth and increased operating profit forecast for Q2-13

To read the full version of the press release, please download the PDF file.

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