Duiven, the Netherlands, April 24, 2013 - BE Semiconductor Industries N.V. ("the Company" or "Besi") (NYSE Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the first quarter ended March 31, 2013.
Key Highlights
Revenue of € 64.0 million up 13.7% vs. Q4-12 and 14.8% vs. Q1-12. Above guidance due primarily to strength in epoxy and flip chip die attach systems for smart phone and tablet applications
Orders increased to € 63.9 million (+22.8% vs. Q4-12) due primarily to increased demand for epoxy, flip chip and multi module die attach systems for smart phone and tablet applications. Down 24.2% vs. Q1-12
Gross margins rose to 39.6% from 36.4% in Q4-12 (37.7% ex restructuring) due to higher volume, favorable customer and product mix and lower European production overhead. Above guidance. Up vs. 39.4% in Q1-12
Pre-tax income increased to € 4.9 million in Q1-13. Up € 7.5 million vs. Q4-12 and € 3.4 million vs. Q1-12
Net income grew to € 3.8 million in Q1-13 vs. € 1.2 million in Q4-12 and € 0.2 million in Q1-12
Outlook
Approximately 10% sequential revenue growth and increased operating profit forecast for Q2-13
To read the full version of the press release, please download the PDF file.
BE Semiconductor Industries N.V. (Besi) specializes in the design, manufacturing and marketing of semiconductor assembly equipment for the global semiconductor and electronics industries. The group develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile Internet, computer, automotive, industrial, RFID, LED and solar energy.
Net sales are distributed geographically as follows: Ireland (7.5%), Europe (8.2%), China (35.5%), Malaysia (8.4%), Korea (7.3%), Taiwan (6.5%), Thailand ( 3.6%), Asia/Pacific (11.8%), United States (8.8%) and other (2.4%).