Duiven, the Netherlands, July 31, 2013 - BE Semiconductor Industries N.V. ("the Company" or "Besi") (NYSE Euronext: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter ended June 30, 2013.
Key Highlights Q2-13
Revenue of € 72.4 million up 13.1% vs. Q1-13 primarily due to higher purchases by Asian subcontractors for smart phone and tablet applications. Down 16.8% vs. Q2-12 due to lower demand for high end smart phones
Orders up 29.5% vs. Q1-13 to € 82.7 million due primarily to increased demand for die attach and molding systems for smart phone and tablet applications. Down 9.3% vs. Q2-12
Gross margins rose to 40.4% from 39.6% in Q2-13 due to higher volume combined with stable production overhead. Down vs. 41.5% in Q2-12
Net income rose to € 6.5 million in Q2-13 vs. € 3.8 million in Q1-13. Down € 3.5 million vs. Q2-12
Key Highlights H1-13
Revenue of € 136.5 million, down 4.4% vs. H1-12
Net income of € 10.3 million, up slightly vs. € 10.2 million in H1-12
Outlook
Sound financial performance anticipated in Q3-13. Revenue flat to down 10% vs. Q2-13 reflecting mixed near term industry picture. Cautiously optimistic about industry prospects for 2014
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BE Semiconductor Industries N.V. (Besi) specializes in the design, manufacturing and marketing of semiconductor assembly equipment for the global semiconductor and electronics industries. The group develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile Internet, computer, automotive, industrial, RFID, LED and solar energy.
Net sales are distributed geographically as follows: Ireland (6.4%), Europe (6%), China (25.9%), Malaysia (12.1%), Taiwan (12%), Korea (10.1 %), Thailand (5.4%), Japan (2.3%), Asia/Pacific (8.1%), the United States (8.2%) and other (3.5%).