Duiven, the Netherlands, July 6, 2016 - BE Semiconductor Industries N.V. (the 'Company' or 'Besi') (Euronext Amsterdam: BESI; OTC markets: BESIY, Nasdaq International Designation), a leading manufacturer of assembly equipment for the semiconductor industry, will host an Advanced Packaging Technology Symposium during the SEMICON West tradeshow on Wednesday July 13, 2016, from 1.00 p.m. till 5.00 p.m. at the Moscone Convention Center, South Hall, room 309.

Industry experts and Besi senior management will discuss topics in wafer level packaging, 2.5D and 3D packaging, EMI shielding (sputtering) and power package technology (sintering).

A detailed agenda can be found at our website: www.besi.com.

Attendees can register for the technical seminar by sending an email to: sales@besi.com.

To read the full version of our press release, please read the PDF file.

BE Semiconductor Industries NV published this content on 06 July 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 06 July 2016 16:10:07 UTC.

Original documenthttp://www.besi.com/investor-relations/press-releases/details/be-semiconductor-industries-to-host-advanced-packaging-technology-symposium-at-semicon-west/

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