Cadence Design Systems, Inc. : Cadence Announces STMicroelectronics has Taped Out 20-Nanometer Test Chip Using Cadence Tools
05/31/2012| 09:51am US/Eastern
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Cadence Announces STMicroelectronics has Taped Out
20-Nanometer Test Chip Using Cadence Tools
Industry Leaders Demonstrate 20 Nanometer Readiness for
Digital, Custom Analog and Mixed-Signal SoC Design
SAN JOSE, Calif., 31 May 2012
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in
global electronic design innovation, today announced that
it has contributed to STMicroelectronics having taped out
a 20-nanometer test chip, incorporating custom analog and
digital methodologies to enable mixed-signal SoC design
at this advanced process node. Engineers from the two
companies collaborated closely to develop technologies
and deploy methodologies using the Cadence Encounter and
Virtuoso
platforms to enable design, implementation and signoff,
in addition to development of foundational IP and a
SKILL-based process design kit (PDK) for the 20-nanometer
process.
This 20-nanometer tapeout marks an industry milestone for
Cadence as the leader in delivering an end-to-end mixed-signal
design flow for 20 nanometers. As part of this
collaboration, STMicroelectronics has deployed the full
Cadence® 20-nanometer flow, physical IP libraries and the
related PDK.
"At 20 nanometers, custom analog IP creation and digital
implementation are highly interdependent, and an optimal
methodology must cover the custom analog and digital
aspects of mixed-signal chip design, verification and
implementation," said Dr. Chi-Ping Hsu, senior vice
president, research and development, Silicon Realization
Group at Cadence. "Working together over the past two
years, Cadence and STMicroelectronics successfully
deployed an efficient methodology and design automation
to address the requirements for designing complex
mixed-signal SoCs."
ST performed automated layout generation using Cadence
Virtuoso® Layout Suite into STMicroelectronics' custom IP
design development, including foundation IP, PLL and
video DAC. To help ensure accurate results, designers
used a 20-nanometer PDK that enables advanced capability
such as Modgens, constraints and space-based routing. The
Encounter® Digital Implementation (EDI) System provided
20-nanometer physical implementation capabilities for the
tapeout, handling 20-nanometer process requirements
during placement and optimization as well as routing.
"Our commitment to delivering mixed-signal SoC design
capability at 20 nanometers required a collaboration
partner that had deep knowledge in both analog and
digital design methodology," said Philippe Magarshack,
group vice president of Technology Research and
Development at STMicroelectronics. "We selected Cadence
at the start of our 20-nanometer development, and today's
milestone demonstrates the success of that
collaboration."
About Cadence
Cadence enables global electronic design innovation and
plays an essential role in the creation of today's
integrated circuits and electronics. Customers use
Cadence software, hardware, IP, and services to design
and verify advanced semiconductors, consumer electronics,
networking and telecommunications equipment, and computer
systems. The company is headquartered in San Jose,
Calif., with sales offices, design centers, and research
facilities around the world to serve the global
electronics industry.www.cadence.com.