SAN JOSE, Calif., May 11, 2015 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced that Opalum's small speaker enhancement software technologies have been optimized for the Cadence(®) Tensilica(®) HiFi digital signal processors (DSPs). Opalum's technologies bring big sound to constrained mobile speakers, improving audio rendering with increased loudness, clarity and bass. With Opalum's software now optimized for the low-power Tensilica HiFi DSP, the sound improvement from Opalum is available with far less battery life impact than implementations that run these algorithms on conventional applications processor CPUs.

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For more information on Tensilica HiFi DSP family, visit http://www.cadence.com/news/HiFi_Opalum. For more information on the Opalum products, visit http://www.opalum.com/technology

Opalum's technologies include:


    --  Opalum Actisonic® enables unprecedented sound quality from physically
        constrained, ultra-low-cost and challenging accoustic designs, giving
        engineers more design freedom.
    --  Opalum VirtualSub(TM) creates a deep and natural bass impression from
        constrained acoustic form factors and/or amplifiers.
    --  Opalum Protect(TM) provides feedback speaker protection, reducing
        warranty returns due to speaker failure.

"Nowadays, we expect our smartphone to be equipped with an awesome camera, yet we do not expect great sound from mobile devices. We intend to change that perception and the Tensilica HiFi platform is a great vehicle for deployment into mobile devices," said Par Gunnars Risberg, CEO of Opalum. "Our technologies are focused on enabling clear and rich sound regardless of industrial design constraints. Bringing great sound to unexpected items is what we call the Sound of Things."

"One of the biggest complaints we hear from designers is that the quality of the audio experience is limited by the speakers in their devices," said Larry Przywara, group director of audio/voice IP marketing, Cadence. "Opalum's technologies can compensate for compromised or space-constrained designs, enabling clearer, more expansive audio with increased volume in these devices. Their products are very valuable additions to the software ecosystem for the HiFi DSPs."

Tensilica HiFi DSPs, based on the Xtensa(®) processor platform, are the most widely used and licensable audio/voice DSP family, with support for over 150 proven audio/voice software packages from over 70 software partners.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at http://www.cadence.com.

© 2015 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Tensilica, Xtensa, and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.



    Cadence Newsroom      Opalum Contact

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SOURCE Cadence Design Systems, Inc.