CHIPMOS TECHNOLOGIES INC. |
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 45.65 TWD | -2.56% |
|
-6.26% | +8.05% |
| Sales 2024 * | 23.58B 725M | Sales 2025 * | 25.21B 775M | Capitalization | 33.2B 1.02B |
|---|---|---|---|---|---|
| Net income 2024 * | 2.55B 78.45M | Net income 2025 * | 3.81B 117M | EV / Sales 2024 * | 1.47 x |
| Net Debt 2024 * | 1.44B 44.37M | Net cash position 2025 * | 2.36B 72.66M | EV / Sales 2025 * | 1.22 x |
| P/E ratio 2024 * |
13
x | P/E ratio 2025 * |
8.71
x | Employees | 5,688 |
| Yield 2024 * |
4.78% | Yield 2025 * |
5.54% | Free-Float | 82.47% |
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* Assessed data
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Latest transcript on ChipMOS TECHNOLOGIES INC.
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| 1 day | -2.56% | ||
| 1 week | -6.36% | ||
| Current month | -8.70% | ||
| 1 month | -6.17% | ||
| 3 months | +6.29% | ||
| 6 months | +14.27% | ||
| Current year | +8.05% |
1 week
44.85
48.65
1 month
44.8552.80
Current year
40.8052.80
1 year
34.5552.80
3 years
28.4061.40
5 years
22.1561.40
10 years
20.1561.40
| Managers | Title | Age | Since |
|---|---|---|---|
Shih Chieh Cheng
CHM | Chairman | 65 | 97-07-16 |
Silvia Su
DFI | Director of Finance/CFO | 52 | 17-09-30 |
Kuo Liang Huang
BRD | Director/Board Member | 58 | 07-04-16 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Silvia Su
DFI | Director of Finance/CFO | 52 | 17-09-30 |
Shih Chieh Cheng
CHM | Chairman | 65 | 97-07-16 |
Chin Shyh Ou
BRD | Director/Board Member | 65 | 07-06-27 |
| Name | Weight | AuM | 1st Jan change | Investor Rating |
|---|---|---|---|---|
| 0.01% | 4 M€ | -4.41% | - | |
| 0.01% | 117 M€ | -1.55% | - | |
| 0.00% | 34 M€ | +1.25% | - |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-04-19 | 45.65 | -2.56% | 4,673,095 |
| 24-04-18 | 46.85 | -1.26% | 1,636,705 |
| 24-04-17 | 47.45 | +1.28% | 2,165,265 |
| 24-04-16 | 46.85 | -2.60% | 4,224,066 |
| 24-04-15 | 48.1 | -1.23% | 1,817,403 |
End-of-day quote Taiwan S.E., April 18, 2024
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ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits (IC) packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Companyâs products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. It mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Calendar
2024-05-08
- Q1 2024 Earnings Release
Trading Rating
Investor Rating
ESG Refinitiv
B+
Sell
Buy
Mean consensus
BUY
Number of Analysts
4
Last Close Price
45.65
TWD
Average target price
50.5
TWD
Spread / Average Target
+10.62%
EPS Revisions
| 1st Jan change | Capi. | |
|---|---|---|
| +8.05% | 1.05B | |
| +20.43% | 352B | |
| +32.77% | 110B | |
| +8.15% | 20.05B | |
| +1.99% | 19.16B | |
| +40.91% | 11.08B | |
| +10.78% | 8.74B | |
| -14.34% | 7.13B | |
| -29.49% | 5.78B | |
| +28.93% | 5.48B |
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