By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor Oeelund, Jakob (Alleroed, DK), filed on April 18, 2013, was made available online on March 19, 2015.
The patent's assignee is Coloplast A/S.
News editors obtained the following quote from the background information supplied by the inventors: "Wound dressings comprising soft adhesive or very thin wound dressings may be difficult to handle during application as they may easily wrinkle or cling to themselves. The same situation may occur when handling ostomy appliances with soft adhesive base plates.
"Whereas a conventional hydrocolloid adhesive wafer is rather stiff and thereby easy to handle and apply, the soft adhesive wafers are soft and mechanical unstable and may easily fold and stick to themselves during application.
"When applying an adhesive wafer around a stoma or over a wound the conventional hydrocolloid adhesive wafers are relatively stable and easy to handle, even when the protection layer covering the skin-contacting adhesive surface before application is fully removed prior to application. The constructions of the current hydrocolloid adhesives are carried out in such a manner that the wafer, when the protection layer is removed, is stiff enough in order for the wafer to stay in an almost planar manner when held in horizontal position. In other words, the wafer does not bend, curl or fold significantly during application.
"This is due to the choice of backing layer and adhesive. The backing layer is usually a relatively stiff polymer backing film with a high modulus of elasticity and the adhesive is a polymer based continuous phase filled with particles that add to the modulus of the adhesive. The combination of a high modulus backing and adhesive makes the adhesive wafer quite stiff.
"Adhesive wafers made from soft adhesives are also known and facilitate enhanced flexibility and comfort to the user. However, when handling wafers made from soft adhesives, and combined with low modulus backing layers, problems may occur in the application situation. Such adhesive wafers are very soft, flexible and unable to hold themselves in a relatively planar manner after removal of the protection layer. The adhesive wafer itself is so flexible that the side portions of the wafer will bend down with gravity after removal of protection layer, resulting in the adhesive may stick to itself, bend, curl or fold and the wafer will be damaged even before it is applied to the body."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "In one aspect of the invention, it relates to an adhesive wafer comprising a protection layer for improving handling and application of soft adhesive wafers.
"In one aspect of the invention, it relates to an adhesive wafer for an ostomy appliance with a protection layer that facilitates easy and stepwise application of the adhesive wafer.
"In yet an aspect of the invention, it relates to an adhesive wafer that can easily be positioned over a wound or around a stoma, preferably without the need of repositioning and unintended contact with the adhesive surface.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 shows an embodiment of the invention shown from the skin facing side,
"FIG. 2 shows the same embodiment where a portion of the protection layer is removed,
"FIG. 3 shows another embodiment of the invention shown from the skin facing side,
"FIG. 4 shows the same embodiment where a portion of the protection layer is removed and
"FIG. 5 shows the same embodiment seen in cross-section."
For additional information on this patent application, see: Oeelund, Jakob. Adhesive Wafer. Filed April 18, 2013 and posted March 19, 2015. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1540&p=31&f=G&l=50&d=PG01&S1=20150312.PD.&OS=PD/20150312&RS=PD/20150312
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