CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor

Scanners at the European Mask and Lithography Conference

Minneapolis, Minnesota - May 9, 2018 -CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.

The conference brings together scientists, researchers, engineers and technologists from around the world to present innovations at the forefront of mask and wafer lithography. CyberOptics' Allyn Jackson will discuss leveling, vibration and effective ways to monitor relative humidity (RH) in reticle scanner environments to reduce a phenomenon called "haze."

"Whether for diagnostics, qualification or preventative maintenance, equipment engineers need to efficiently and effectively make measurements and adjustments to the tool. In reticle environments, these measurement methods are typically cumbersome, non-representative, not in real-time, can compromise the production environment and can lead to costly downtime," said Allyn Jackson, Sr. Field Applications Engineer and Director of Sales for U.S. and Europe at CyberOptics. "By contrast, best practices involve collecting and displaying real-time acceleration, vibration and humidity data to significantly speed equipment set-up and alignment while reducing reticle haze."

Solutions reviewed in the case study will include CyberOptics's ReticleSense® Auto Multi Sensor that can travel throughout the entire reticle environment to wirelessly capture relative humidity (RH) measurements. The device can also measure vibration and leveling - all in real-time to improve yields and tool uptime.

About the WaferSense® and ReticleSense® Line

The WaferSense and ReticleSense measurement portfolio including the Auto Leveling System (ALS & ALSR), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors (APS 2, 3, APSR & APSRQ) and the Auto Multi Sensor (AMS & AMSR), are available in various wafer shaped and reticle shaped form factors depending on the device.

About CyberOptics

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company's anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the success of CyberGage360; and other factors set forth in the

Company's filings with the Securities and Exchange Commission.

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For additional information, contact:

Carla Furanna, CyberOptics, 952-820-5837,cfuranna@cyberoptics.com

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CyberOptics Corporation published this content on 09 May 2018 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 09 May 2018 15:20:06 UTC