Cypress Semiconductor : Introduces Single-Chip Automotive MCU Solution that Drives Hybrid Instrument Clusters, Head-up Displays and Traditional Gauges

August 24, 2016

SAN JOSE, Calif., Aug. 24, 2016 /PRNewswire/ -- Cypress Semiconductor Corp. (NASDAQ: CY) today announced a new addition to its Traveo™ automotive microcontroller (MCU) family with more memory for program code and graphics to support hybrid instrument cluster applications. The new, highly integrated devices in the S6J32xE series provide a single- chip solution that can drive graphics on head-up displays or traditional gauges, but also provides scalability with Cypress's low-pin-count HyperBus™ memory interface. The addition continues Cypress's expansion of its broad automotive portfolio that delivers differentiating performance via its MCUs, memories, wireless radios, capacitive-touch solutions, Power Management ICs (PMICs) and other technologies.

The Traveo S6J32xE series features up to 4MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, along with an ARM® Cortex®-R5 core at 240 MHz performance. The MCUs have up to two 12-pin HyperBus memory interfaces that dramatically improve read and write performance of graphical data and other data or code. The devices can use a single HyperBus interface to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end- users to get new software fixes, features and applications for their vehicles on-the-go. The series includes a Low-voltage Differential Signaling (LVDS) video output, providing a suitable interface to attach external displays such as Thin-Film- Transistors (TFTs). The MCUs support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB. More information on the Traveo MCU family is available at http://www.cypress.com/traveo.

"These new Traveo MCUs are another example of our commitment to expand our automotive portfolio to meet the changing needs of our customers, in this case, addressing the strong growth trend of hybrid clusters and head-up displays," said Takeshi Fuse, senior vice president of the Automotive Business Unit at Cypress. "These new devices provide automotive manufacturers with a high-performance and cost-effective platform, adding to Cypress's ability to bring advanced functionality to mainstream vehicles."

The new Traveo derivatives from the S6J32xE series integrate enhanced secure hardware extension (eSHE) for robust security. The HyperBus interface enables seamless connections with Cypress's HyperFlash™ and HyperRAM™ memories, which deliver read/write bandwidth of up to 200 MBps per channel in combination with Traveo MCUs. The MCUs include 50 channels of 12-bit Analog to Digital Converters (ADC), 12 channels of multi-function serial interfaces and I2S interfaces and an AUDIO DAC to output the complex, high-quality sounds required in today's instrument clusters. Support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time, while a MediaLB interface enables communication with legacy media communication systems. The S6J32xE series supports a wide ambient temperature range

of -40˚C to +105˚C.

The Traveo S6J32xE series is sampling now and will be in production in the early 2017. The MCUs are available in TEQFP- 208 and TEQFP-216 packages.

Cypress works with the world's top automotive companies to bring leading-edge automotive systems typical of luxury models to mainstream vehicles, including Advanced Driver Assistance Systems (ADAS), 3-D graphics displays and full-featured touchscreens. The Cypress-Spansion merger created the industry's No. 3 provider of memories and microcontrollers (MCUs) for the automotive market with a combined portfolio that includes the Traveo MCU family, power-management ICs (PMICs), PSoC® programmable system-on-chip solutions, CapSense® capacitive-sensing solutions, TrueTouch® touchscreens, LED drivers, NOR flash, F-RAM™ and SRAM memories, and USB, Wi-Fi and Bluetooth® connectivity solutions. The portfolio is backed by Cypress's commitment to zero defects, world-class service and by our adherence to the most stringent industry standards, such as the ISO/TS 16949 quality management system, the Automotive Electronics Council (AEC) guidelines for ICs and the Production Part Approval Process (PPAP). Learn more at www.cypress.com/automotive.

Read our Core & Code technical magazine and blog, join the Cypress Developer Community, follow us on Twitter, Facebook and LinkedIn, and watch Cypress videos on our Video Library or YouTube.

Founded in 1982, Cypress is the leader in advanced embedded system solutions for the world's most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress's programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com.

Cypress, the Cypress logo, PSoC and CapSense are registered trademarks and Traveo, HyperBus, HyperFlash, HyperRAM and F-RAM are trademarks of Cypress Semiconductor Corp. All other trademarks are property of their owners.

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