Fujifilm : to launch a new plant for advanced semiconductor materials in Taiwan

November 14, 2016

FUJIFILM Corporation (President: Kenji Sukeno) has announced that its semiconductor business subsidiary, FUJIFILM Electronic Materials Co., Ltd. (President: Keiji Mihayashi; hereinafter 'FFEM'), will launch the operation of its third plant in Taiwan (Tainan Plant) in late November. The company built the plant in the City of Tainan for advanced semiconductor materials, to expand its production in Taiwan. The Tainan Plant starts with the production of developing solutions, and will gradually expand its range of production items.

FFEM established FUJIFILM Electronic Materials Taiwan Co., Ltd. in Taiwan's Hsinchu County in 1996 to start local production of developing solutions and it has expanded its production items to include photoresists*, CMP slurries**and image sensor materials***. In 2014, the second plant (Hsinchu), producing cutting-edge NTI*4developers, went operational in a bid to address the ever-expanding demand for advanced semiconductor materials in Taiwan, which has achieved rapid growth as one of Asia's semiconductor production centers.

The Tainan Plant has been built in Science Park, Tainan City, Taiwan, home to numerous semiconductor foundries that boast large market share globally. Taking advantage of its close proximity to customers' sites, the company strives to boost its customer-support capability and shorten its supply chain. By having multiple production sites including the Tainan Plant, FFEM plans to establish a risk-distributed production structure to ensure a stable supply of advanced semiconductor materials.
FFEM now adds the Tainan Plant to its network of existing production sites in Asia at Shizuoka (Japan), Hsinchu (Taiwan), Suzhou (China) and Cheonan (Korea) to strengthen its stable supply of advanced semiconductor materials and improve quality control further in order to attain a higher level of customer satisfaction.

FFEM produces and provides a worldwide supply of advanced semiconductor materials including photoresists, image sensor materials, developing solutions, cleaners and CMP slurries used in the manufacturing process of semiconductors. With the imminent arrival of the age of the Internet of Things (IoT), the semiconductor market is expected to make continued growth. FFEM will continue to supply products useful for semiconductor manufacturing, and expand the customer support structure, in its contributions to the advancement of the semiconductor industry.

• *Material coated on the wafer substrate when drawing circuit patterns in the pre-process of semiconductor manufacturing
• **Stands for Chemical Mechanical Polishing. Abrasive agent for polishing and leveling wafers used in the semiconductor manufacturing
• ***Pigmented photosensitive materials for manufacturing the color filters of image sensors (e.g. CCD and CMOS sensor) used in digital cameras and mobile phones
• *4Stands for Negative Tone Imaging. Patterning process that uses a negative-type developer that retains exposed areas on the substrate to achieve more refined details than when using the conventional positive-type development approach

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