inspec Inc. Stock

Equities

6656

JP3152650002

Semiconductor Equipment & Testing

Market Closed - Japan Exchange 02:00:00 2024-04-23 am EDT 5-day change 1st Jan Change
973 JPY +1.67% Intraday chart for inspec Inc. -2.41% -6.53%
Sales 2019 2.85B 18.39M Sales 2020 2.35B 15.16M Capitalization 11.56B 74.65M
Net income 2019 222M 1.43M Net income 2020 70M 452K EV / Sales 2019 1.63 x
Net cash position 2019 118M 762K Net Debt 2020 208M 1.34M EV / Sales 2020 5.01 x
P/E ratio 2019
21.7 x
P/E ratio 2020
155 x
Employees 84
Yield 2019 *
-
Yield 2020
0.1%
Free-Float 75.98%
More Fundamentals * Assessed data
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Inspec Inc. Completes the Development of the New RD3000FB CI
Gregory Stoeckli agreed to acquire 89% stake in First EIE SA from inspec Inc.. CI
Inspec Inc. announced that it has received ¥13.34601 million in funding CI
Inspec Inc. announced that it expects to receive ¥13.34601 million in funding CI
Inspec Inc. Announces Consolidated and Non-Consolidated Earnings Results for the Year Ended April 30, 2020 CI
Inspec Inc. Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2021 CI
Inspec Inc. Announces Consolidated Earnings Results for the Nine Months Ended January 31, 2020; Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2020 CI
Hachimaru Co.,Ltd., Obsession Ltd. and Innovation Engine, Inc. cancelled the acquisition of an unknown stake in Path Imaging Inc. from inspec Inc.. CI
Inspec Inc. Reports Consolidated Earnings Results for the First Quarter Ended July 31, 2019; Provides Earnings Guidance for the Year Ending April 2020 CI
Inspec Inc. Provides Dividend Guidance for the Year Ending April 2020 CI
Inspec Inc. Announces Consolidated and Non- Consolidated Earnings Results for the Year Ended April 2019; Provides Consolidated Earnings Guidance for the Year Ending April 2020 CI
Inspec Inc. Reports Consolidated Earnings Results for the Six Months Ended October 31, 2018; Provides Consolidated Earnings Guidance for the Full Year Ending April 30, 2019 CI
Hachimaru Co.,Ltd.,Obsession Ltd. and Innovation Engine, Inc. agreed to acquire an unknown stake in Path Imaging Inc. from inspec Inc. for ¥19.5 million. CI
Inspec Inc. Reports Consolidated Earnings Results for the Three Months Ended July 31, 2018; Provides Consolidated Earnings Guidance for the Full Year Ended April 30, 2019 CI
Inspec Inc. Reports Consolidated and Non-Consolidated Earnings Results for the Fiscal Year Ended April 30, 2018; Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2019 CI
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1 day+1.67%
1 week-2.41%
Current month-12.42%
1 month-10.82%
3 months-9.91%
6 months-17.96%
Current year-6.53%
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1 week
948.00
Extreme 948
1 010.00
1 month
948.00
Extreme 948
1 150.00
Current year
948.00
Extreme 948
1 261.00
1 year
931.00
Extreme 931
2 280.00
3 years
845.00
Extreme 845
2 428.00
5 years
845.00
Extreme 845
6 250.00
10 years
303.00
Extreme 303
6 250.00
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Managers TitleAgeSince
Founder 70 83-12-31
Director/Board Member 43 12-03-31
Director/Board Member 62 03-02-28
Members of the board TitleAgeSince
Founder 70 83-12-31
Director/Board Member 69 83-12-31
Director/Board Member 62 03-02-28
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Date Price Change Volume
24-04-23 973 +1.67% 12 600
24-04-22 957 +0.10% 9,400
24-04-19 956 -0.10% 15,600
24-04-18 957 -2.45% 46,600
24-04-17 981 -1.60% 9,000

Delayed Quote Japan Exchange, April 23, 2024 at 02:00 am EDT

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inspec Inc. is engaged in the manufacturing and sales of semiconductor package substrates and precision substrate inspection equipment, precision substrate manufacturing equipment and digital pathology related equipment. The Company operates in three segments. Semiconductor Package Substrates and Precision Substrate Inspection Equipment segment is engaged in the development and manufacturing of appearance inspection equipment such as semiconductor package substrates and precision printed circuit boards used for advanced digital devices such as smartphones, tablets, personal computers (PCs) and wearable terminals. Precision Substrate Manufacturing Equipment segment develops, manufactures, sells and provides maintenance services for photoplotters for printed circuit boards, inkjet printers, and direct imaging devices. Digital Pathology Related Equipment develops, manufactures and sells medical image processing system whole slide imaging (WSI).
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