IXYS Corporation (NASDAQ: IXYS), a leader in power semiconductors and integrated circuit technologies for energy efficient products used in power conversion and motor control applications, today introduced solderable or sinterable top side on 200 and 300 Amps, 650 Volt Trench XPTTM IGBT silicon dies.

The top side solderable metallization improves the power cycling capabilities of power modules. Replacing the standard bond wire connections by using the standard soldering process improves the power cycling capability, and increases the surge current capabilities of these dies. The improved top metallization also enables the use of a sintering bonding process for these IGBTs, which provide a solderless structure, free of thermal fatigue and better thermal conductivity. Additionally, the top side soldering gives the benefit of top side cooling and better surface lateral high current flow uniformity, thus enabling higher power outputs with less "hot spots" and less "current hogging".

"The solderable topside enables the module designer to create low inductive designs which has increasing interested for these high power and high speed devices," commented Jeroen van Zeeland, head of Marketing for IXYS GmbH. "Improved surface thermal conductance, reduced series resistance and better thermal cycling come with improved switching performance, a benefit that our customers for dies and modules are getting."

Introducing solderable top side Trench XPTTM IGBTs is a natural evolution for IXYS, since the top side soldering processes has been used for decades in the IXYS bipolar power module products.

These new IGBT products fit the high current applications for IGBTs in motor control, inverters, automotive and transportation, UPS, welding, and other high current Industrial applications.

Availability

First available products are the IX112T06M-AG, a 650V 200A Trench XPTTM IGBT, and the IX150T06M-AG, a 650V 300A Trench XPTTM IGBT. These new IGBT dies and also the counterpart Free Wheeling diodes based on SONIC technology are available in production quantities. For additional information, please contact your local sales representative at: http://www.ixys.com/SalesContacts.aspx or visit http://ixapps.ixys.com/DataSheet/IX112T06M-AG.pdf for the datasheet.

About IXYS Corporation

Since its founding, IXYS Corporation has been developing power semiconductors and mixed signal ICs to improve power conversion efficiency, generate solar and wind power and provide efficient motor control for industrial applications. IXYS and its subsidiary companies offer a diversified product base that addresses worldwide needs for power control in the growing cleantech industries, renewable energy markets, telecommunications, medical devices, transportation applications, flexible displays and RF power.

Safe Harbor Statement

Any statements contained in this press release that are not statements of historical fact, including the benefits, savings, efficiency, performance, features and suitability of products for various applications, may be deemed to be forward-looking statements. There are a number of important factors that could cause the results of IXYS to differ materially from those indicated by these forward-looking statements, including, among others, risks detailed from time to time in the Company's SEC reports, including its Form 10-Q for the fiscal quarter ended September 30, 2013. The Company undertakes no obligation to publicly release the results of any revisions to these forward-looking statements.

for IXYS Corporation
Jeroen van Zeeland, +49 (0) 6206 503 630