Electron beam source for vacuum metal deposition suitable for low-temperature process such as lift-off process for electrode film applications.
This e-beam source is equipped with a backscattered electron trap and designed to prevent cross-contamination.

Low-temperature and low-damage deposition

A high-efficiency backscattered electron trap is equipped in the standard configuration, making it possible to capture diffusing reflected electrons.
And enhanced cooling effect of the e-beam source can lower radiation heat from around evaporation source.
These two effects enable to reduce the temperature increase of the substrates during high-rate deposition of metallic substances.
And also can reduce the damage to the substrates and/or the under layers caused by reflected electrons irradiation.

  • Conventional e-guns cause substrate temperature rise during vacuum deposition due to thermal effect of backscattered electrons and radiation heat from around evaporation source.
  • Chamber wall, baseplate and covers are heated by hitting backscattered electrons and then secondary and tertiary radiation heat arise from there.
  • When backscattered electrons irradiate substrates directly, the substrates temperature increase highly.

Thick-film deposition / Multi-layer coating

Optional large capacity 40 ml crucibles (4-pocket or 6-pocket) enable thick-film deposition and/or multi-layer coating by using several evaporation materials.

Cross-contamination prevention

Prevent contamination of evaporated material from inflowing into adjacent pockets.

Easy maintenance

Each covers can be taken off easily, therefore cleaning of deposited evaporation materials doesn't take a lot of trouble.
Optional crucibles can be taken off and separated from e-gun. And upper hearth is exchangeable.
Filament lifetime is long and filament exchange is also easy.

Deposition rate example of metallic materials

Lift-off process

Able to keep substrate temperature during vacuum deposition at less than 100 degrees C.
Thus, can prevent deformation of resist pattern, making it possible to improve the yield ratio of lift-off process.

Application examples: Electrode film formation of LED, SAW filter, Power semiconductor, MEMS, etc.

Jeol Ltd. published this content on 19 August 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 19 August 2016 02:15:03 UTC.

Original documenthttp://www.jeol.co.jp/en/products/detail/BS-60211DEM_60210DEM.html

Public permalinkhttp://www.publicnow.com/view/0B5521CD9EA9E0035E331FF2A42945E8D3D09FA5