Thermal damage can be reduced by cooling the specimen with liquid nitrogen during processing.
Designed to suppress the consumption of liquid nitrogen, allowing long cooling periods.
Rapid cooling of the specimen while immersed in liquid nitrogen. Return to room temperature. Designed to allow parts to be detached.
Incorporates a mechanism to allow the process from polishing to observation to be performed with exposing the sample to the air.
Features of IB-19520CCP
* For the Normal milling (without cooling), there are visible voids at the boundary between the iron and zinc, which are not seen in the cooled.
* For the Normal milling (without cooling), the bonding agent is deformed by heat damage, and large voids appear. At -150℃, the cooling is excessive, and voids can be seen at the boundary of the bond and the dull side of Si wafer.
There are no voids in the sample prepared with cooling temperature control.
The status of the cross-section milling can be monitored in real-time with the CCD camera.
And the magnification can be varied.
An optional ion beam sputter function is available.
Create thin coatings with good granularity.
Ideal for cases requiring pattern recognition, like EBSD.
The ion beam is irradiated at a low angle relative to the sample, allowing contamination on the surface layer to be removed, as well as smoothing of the surface.
It is also ideal for selective etching.
This is a kit for performing ion beam milling while rotating the sample.
This kit is used with the Planar ion milling holder.
Makes it possible to create cross-sections of samples prone to streaking when milled, such as porous materials, powders and fibers.
Jeol Ltd. issued this content on 16 March 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 16 March 2016 09:02:31 UTC
Original Document: http://www.jeol.co.jp/en/products/detail/IB-19520CCP.html
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