Kulicke and Soffa : & Soffa Introduces New Offerings at Productronica 2015
November 05, 2015 at 03:01 am EST
Share
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company") will be showcasing newly launched equipment and
market leading packaging solutions at the Productronica 2015 show in
Germany from November 10-13.
Continuing with the successful launch of the AsterionTM
hybrid wedge bonder, K&S will be introducing handling options of AsterionTM
i-One at the Productronica show. In addition to this single
magazine-handler wedge bond hybrid solution, the Company will be
demonstrating capabilities and enhancements of its leading advanced
pick-and-place, wedge and wire bonding offerings which are positioned to
solve the next generation of interconnect challenges.
The AsterionTM i-One is a compact, single magazine-handler
solution designed and integrated for the Company’s latest enhanced
capability hybrid wedge bonder. This integrated solution can be
customized to handle master card direct bonded copper (DBC) substrate,
singulated DBC substrate, modules, flat boatand J-boat
carriers. The barcode reader kit on the machine is capable of reading
1D or 2D barcode for strip mapping functionality. Optional hand held
barcode reader kit for traceability is also available.
The iFlex with its new design offers an increase in feeder capacity -
achieving 25% more feeder positions. Combining this increased feeder
capacity, with the high volume and high quality iX system delivers the
Flexline, which offers best-in-class flexibility, fast changeovers and
the lowest defect rates.
The Hybrid 3 is a multi-application solution for advanced packaging
with one of the lowest defect rates and highest throughput in the
industry. It delivers a placement accuracy of less than 10µm, making
it ideal for wafer level packaging, Fan-out wafer level packaging
(FOWLP), System-in-Package (SiP), Multi-chip module (MCM), flip-chip,
modules and embedded components. Having evolved from the high speed
AX/iX product family, the Hybrid 3 is highly capable of placing both
die and passive components with a single machine.
The high-performance semiconductor wedge bonder platform, PowerFusionPSTM,
is driven by a new powerful direct-drive motion system and expanded
pattern recognition capabilities which deliver industry leading
productivity and reliability.
With upgraded and enhanced subsystems, the IConnPS PLUSTM
machines are engineered to deliver all the capabilities needed for
wire bonding today PLUS tomorrow. The bonders were designed with new
capabilities and enhanced features focusing on five key areas: process
robustness and portability, scalable production, ease-of-use,
state-of-the-art servo motion control and upgradeability.
Customers can see these technical solutions at the Productronica show in
Munich, Germany, Hall A2, Booth #339 from November 10-13, 2015.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20151105005026/en/
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.