Kulicke and Soffa : & Soffa Introduces New Offerings at SMT Hybrid Packaging Show
May 04, 2015 at 07:02 am EDT
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Press Conference on May 6, 2015 at 10:00 a.m. CEST
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company") will be showcasing newly launched products and
state-of-the art equipment during the SMT Hybrid Packaging show in
Germany from May 5-7.
The new, enhanced capability, hybrid wedge bonder, the AsterionTM,
was successfully launched in March in China and will be debuting in
Europe at the SMT show. The new Configurable High-Power Bond Head will
also be introduced at the show along with the iFlex T2, iFlex H1, and
Hybrid 3 advanced pick-and-place solutions and the PowerFusionTM
High Performance Semiconductor wedge bond solution.
The Asterion Wedge bonder is built on an enhanced architecture that
includes an expanded bond area, new robust pattern recognition
capabilities and extremely tight process controls. Together these
deliver heightened productivity, bonding quality, and reliability.
The enlarged bondable area enhances flexibility and reduces line
integration costs.
The New Configurable High Power Bond Head addresses the industry’s
growing and changing applications needs by handling a multitude of
interconnect materials including large and small aluminum wire, copper
wire, PowerRibbonTM, as well as aluminum copper-clad
ribbon.
PowerFusion – High Performance Semiconductor Wedge Bonder is driven by
a new powerful direct-drive motion system and expanded pattern
recognition capabilities which deliver industry-leading productivity
and reliability.
The iFlex T2 and H1 systems offer best in class flexibility, fast
changeover and the lowest defect per million (DPM) rates in the
industry. These advanced solutions can place all types of passive and
discrete SMT components and also handle multifunctional and
end-of-line placements.
The Hybrid 3 is a multi-application solution for advanced packaging
with one of the lowest DPM and highest throughput in the industry. It
delivers a placement accuracy of less than 10 µm, making it ideal for
wafer level packaging, FOWLP, SiP, MCM, flip-chip, modules and
embedded components. Having evolved from the high speed AX/iX product
family, the Hybrid 3 is highly capable of placing both die and passive
component with a single machine.
Customers can see these technical solutions at the SMT Hybrid Packaging
show at the Messezentrum in Nuremberg, Germany, Hall 7A, Booth #317,
from May 5-7, 2015. There will be a press conference at 10:00 a.m. CEST
on May 6, 2015 in the booth to introduce the new wedge bonding solutions.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.
KULICKE AND SOFFA INDUSTRIES, INC. 
