Kulicke and Soffa : & Soffa to Present at Upcoming Investor Conferences
May 17, 2016 at 09:06 am EDT
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Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”), today announced its participation at two
upcoming investor conferences taking place in Hollywood and San
Francisco, California.
B. Riley & Co. 17th Annual Investor
Conference
Wednesday, May 25 at the Loews Hollywood
Hotel in Hollywood, California
A live, listen only, webcast
will be available at 11:30 a.m. EDT on May 25 on the investor
relations section of the Kulicke & Soffa website at investor.kns.com.
Stifel Technology, Internet & Media Conference 2016
Tuesday,
June 7 at the Fairmont San Francisco in San Francisco, California
A
live, listen only, webcast will be available at 5:25 p.m. EDT on June
7 on the investor relations section of the Kulicke & Soffa website at investor.kns.com.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20160517005223/en/
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.