Melexis : Discover Melexis’ Time-of-Flight chipset in tofmotion’s industrial 3D cam
November 20, 2017 at 05:56 am EST
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Tessenderlo, Belgium - 20 November 2017 - Melexis' partner tofmotion, specialized in creating overall solution packages in depth sensing and imaging will showcase their TFM 3D cameras at sps ipc drives. The TFM IC5 cam, based on the Melexis' Time-of-Flight chipset, enables fastest 3D imaging at full QVGA resolution. The camera is rugged and certified for industrial and outdoor environment and it can record depth data maps up to 160 frames per second and are able to process all images at the onboard processor immediately. Object detection and classification targeted to your application minimizes data transfer and allows direct connection to automation and control, as well as to robotics (ROS). The TFM IC5 cam can be used as a ready-to-use camera for evaluation purposes.
Tofmotions services consist of feasibility studies, prototyping based on Melexis' evaluation kit and organizing a ToF training center. Experience Melexis' products in action at tofmotion's booth at sps ipc drives from 28 to 30 November 2017: booth 450, hall 3A.
Melexis NV published this content on 20 November 2017 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 20 November 2017 10:55:05 UTC.
Original documenthttps://www.melexis.com/en/news/2017/20nov2017-tofmotion---melexis
Public permalinkhttp://www.publicnow.com/view/10AC5ACDF03AF0422E32E133B5C49ECFA363457F
Melexis N.V. specializes in the design and marketing of semi-conductors intended primarily for automotive equipment manufacturers. The group's activity is primarily organized around 4 families of products:
- sensors: primarily circuits for interfaces, pressure and acceleration measurement, and magnetic sensors;
- actuator: micro-controllers and peripheral integrated circuits used for dashboard indicators, windshield wipers, automatic door openers, etc.;
- radiofrequency circuits: transmitters, receivers, automatic identification systems, etc.;
- multiplexing circuits: optical and infrared circuits.
At the end of 2023, the group had 5 manufacturing sites located in Belgium, Germany, France, Bulgaria and Malaysia.
Net sales are distributed geographically as follows: Germany (12.6%), Switzerland (2.7%), Romania (2.6%), France (2.2%), Italy (1.8%), Austria (1.6%), Hungary (1.1%), the United Kingdom (0.3%), Spain (0.3%), Europe/Middle East/Africa (6%), China (15.5%), Hong Kong (9.5%), Japan (8.2%), Thailand (7.7%), South Korea (7%), Asia (10%), the United States (5.8%), Mexico (2.9%) and Americas (2.2%).
MELEXIS N.V. 
