MENTOR GRAPHCS : Mentor Graphics Works with Tezzaron and MOSIS on 3D-IC Prototyping Service
06/03/2011 | 09:05am
Mentor
Graphics Corporation (NASDAQ: MENT) today announced a cooperative
effort with Tezzaron Semiconductor and MOSIS to provide IC designers
with a way to economically develop and manufacture 3D-IC prototypes on
multi-project wafers (MPWs). The process enables designs using tens of
millions of through silicon vias (TSVs) with dimensions as small as 1.2
x 6 microns and a pitch of 2.4 microns, producing up to 300,000 vertical
interconnects per square millimeter.
"Our collaboration allows firms to explore practical applications of
true 3D-IC integration in a way that reduces risk and cost, while taking
advantage of over a decade of experience in manufacturing 3D-ICs with
high density TSVs," said Robert Patti, CTO of Tezzaron Semiconductor.
"Adding Tezzaron's offering to our Multi Project Wafer (MPW) services
allows companies to test out 3D-IC concepts using the same provider and
model they currently use for their standard semiconductors," said Wes
Hansford, director at MOSIS. "By coordinating resources and schedules,
we can significantly reduce the effort and risk involved in getting the
silicon-proven data required to make effective product roadmap
decisions."
"We're working with Tezzaron and MOSIS to ensure that even at the
prototype stage our customers will be able to access
production-certified Calibre solutions to verify that their 3D-IC
designs are manufacturable," said Joseph Sawicki, vice president and
general manager of the Design-to-Silicon Division at Mentor Graphics.
"The Calibre solution uses foundry-certified PDKs from MOSIS wafer
suppliers with extensions for MOSIS-Tezzaron 3D-IC designs."
Customers can use the 3D-IC service to create proof-of-concept ICs that
demonstrate the use of high-density TSVs in stacked die configurations
for intelligent sensor, multi-core processor and many other
applications. MOSIS manages MPW projects including reticle creation, fab
reservations, final packaging and testing, and other logistics. Tezzaron
enhances customer designs as required for successful 3D-IC integration
and also provides backend manufacturing steps including wafer thinning,
backside metal and wafer bonding. Mentor provides DRC and LVS tools that
support 3D-IC physical verification, ensuring that designs are correct
and will meet 3D process requirements.
For more information about the 3D-IC prototyping service, please go to
the MOSIS web site at www.mosis.com.
About Tezzaron
Tezzaron® Semiconductor specializes in 3D wafer stacking, TSV
processes, and cutting-edge memory products. In 2004, Tezzaron
demonstrated the world's first successful 3D-ICs with TSV, including
microprocessors, sensors, and SRAM devices. Tezzaron was founded in 1999
and maintains its headquarters at 1415 Bond Street, Suite 111,
Naperville, IL 60563 (www.tezzaron.com).
About MOSIS
MOSIS is a low-cost prototyping and small-volume production service for
VLSI circuit development. Since 1981, MOSIS has fabricated more than
50,000 circuit designs for commercial firms, government agencies, and
research and educational institutions around the world.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in
electronic hardware and software design solutions, providing products,
consulting services and award-winning support for the world's most
successful electronic, semiconductor and systems companies. Established
in 1981, the company reported revenues over the last 12 months of about
$915 million. Corporate headquarters are located at 8005 S.W. Boeckman
Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.
(Mentor Graphics and Calibre are registered trademarks of Mentor
Graphics Corporation. All other company or product names are the
registered trademarks or trademarks of their respective owners.)
Mentor Graphics
Gene Forte, 503-685-1193
gene_forte@mentor.com
or
Sonia
Harrison, 503-685-1165
sonia_harrison@mentor.com
© Business Wire 2011
