TOKYO, March 4, 2015 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today the launch of three new transfer-mold power semiconductor models in its lineup of Super-mini Dual-In-line Package Intelligent Power Modules (DIPIPMTM) embedded with Super-Junction Metal-Oxide-Semiconductor Field-Effect Transistors (SJ-MOSFET), including new 10A/600V and 20A/600V models and a revised 15A model that offers improved performance. The 15A and 20A models will launch on May 22.
Product Features
1)
Expanded lineup will cover full power range of air conditioners
-
Air conditioners ranging from 2.2kW to 8kW will be covered thanks to the new 10A/600V and 20A/600V models.
2)
Reduced power consumption in inverter systems
-
SJ-MOSFET chip uses high-precision processing method to reduce power loss by about 14% compared to Mitsubishi Electric's existing Super-mini DIPIPM products.
3)
Simplified design for inverter systems
-
Footprint and pin configuration are compatible with Mitsubishi Electric's existing Ver.6, PSSxx92x6 series, etc. of Super-mini DIPIPM.
-
Fewer external components due to use of embedded bootstrap diode with current-limiting resistor.
Sale Schedule
Model
Specification
First Shipment
PSM10S94F6
10A/600V
June 19, 2015
PSM15S94H6
15A/600V
May 22, 2015
PSM20S94H6
20A/600V
May 22, 2015
Public Relations Division
Mitsubishi Electric Corporation
Power Device Overseas Marketing Dept.A and Dept.B
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation is one of the world's leading manufacturers of electric and electronic equipment. Net sales (including intragroup) break down by family of products and by services as follows:
- industrial automation equipment (28.6%): programmable controllers, motor operators, counters, industrial robots, clutches, etc.;
- electric equipment (24.2%): generators, motors, transformers, power circuit breakers, testing systems, etc.;
- household appliances (22.4%): televisions, video recorders, air conditioners, refrigerators, lamps, vacuum cleaners, etc.;
- information and communication equipment (6.9%): mobile phones, satellites, aerials, medical and audiovisual equipment, servers, computers, etc.;
- electronic components and devices (4.7%): memory, logic integrated circuits, monitors, plasma screens, printed circuit cards, etc.;
- other (13.2%): financial services, real estate management, engineering and maintenance services, etc.
Net sales break down geographically as follows: Japan (52.1%), Asia (24.9%), Europe (11.1%), North America (10.3%) and other (1.6%).