Mitsubishi Electric : to Launch MISOP Surface-mount Package IPM
April 16, 2018 at 05:22 am EDT
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TOKYO, April 16, 2018
- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it would launch a MISOPTM (Mitsubishi Electric Intelligent Small Outline Power Module) surface-mount package intelligent power module (IPM) that will facilitate the implementation of low cost inverter systems, thanks to its compact and easily soldered package design. Featuring a well-arranged pin layout, integrated driver ICs and protection circuits, the new MISOP is expected to lead to inverter systems with smaller and simpler designed printed circuit board (PCB). In addition, PCB mounting using reflow soldering will allow easier and lower-cost assembly compared to products requiring through-hole mounting. It will be launched on September 1.
Mitsubishi Electric's new MISOP will be exhibited at major trade shows, including MOTOR TECH JAPAN 2018 during TECHNO-FROTIER 2018 in Makuhari, Japan from April 18 to 20, PCIM Europe 2018 in Nuremberg, Germany from June 5 to 7, and PCIM Asia 2018 in Shanghai, China from June 26 to 28.
MISOP surface-mount package IPM
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Mitsubishi Electric Corporation published this content on 16 April 2018 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 16 April 2018 02:06:01 UTC
Mitsubishi Electric Corporation is one of the world's leading manufacturers of electric and electronic equipment. Net sales (including intragroup) break down by family of products and by services as follows:
- industrial automation equipment (28.6%): programmable controllers, motor operators, counters, industrial robots, clutches, etc.;
- electric equipment (24.2%): generators, motors, transformers, power circuit breakers, testing systems, etc.;
- household appliances (22.4%): televisions, video recorders, air conditioners, refrigerators, lamps, vacuum cleaners, etc.;
- information and communication equipment (6.9%): mobile phones, satellites, aerials, medical and audiovisual equipment, servers, computers, etc.;
- electronic components and devices (4.7%): memory, logic integrated circuits, monitors, plasma screens, printed circuit cards, etc.;
- other (13.2%): financial services, real estate management, engineering and maintenance services, etc.
Net sales break down geographically as follows: Japan (52.1%), Asia (24.9%), Europe (11.1%), North America (10.3%) and other (1.6%).