19 Nov 2015

Aylesbury, Buckinghamshire, UK - November 2015 - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded a 2015 Global Technology Award for its 4800 Wafer Level Bondtester. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during productronica.

The Nordson DAGE 4800 Bondtester is at the forefront of wafer testing technology, developed for testing wafers from 200mm up to 450mm. Intuitive and intelligent Nordson DAGE Paragon™ software provides the ultimate flexibility for the creation and mapping of wafers, enabling quick and precise setup of test patterns. The virtual images for each test pattern enable easy editing.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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