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NVIDIA : Patent Issued for Internally Die-Referenced Thermal Transfer Plate (USPTO 9775229)

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10/05/2017 | 11:59pm CET

By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent by the inventors Haley, David (Santa Clara, CA); Galutera, Carlo (Santa Clara, CA), filed on January 25, 2017, was published online on September 26, 2017, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 9775229 is assigned to Nvidia Corporation (Santa Clara, CA).

The following quote was obtained by the news editors from the background information supplied by the inventors: "Over time, microprocessors and associated components have decreased in size significantly, while their performance has dramatically increased. This is particularly the case in mobile devices. Mobile devices, such as smartphones, personal digital assistants, mobile internet devices, including automobile applications, and portable gaming devices have all evolved to require higher microprocessor and graphic performances. Each new generation of mobile processors has delivered significantly higher CPU and GPU performance while improving its architectural and power efficiency. These high performance processors have enabled significantly improved mobile computing experiences in smartphones and tablets, such as full-featured Web browsing, console class gaming, fast UI and multitasking responsiveness, and Blu-ray quality video playback.

"However, maintaining a small compact form factor (height, width, and length) is an important technological goal of most, if not all, of these microprocessor devices. Even though these components are small, they generate a significant amount of heat. This heat, if not adequately dissipated or conducted away from the device, can decrease its performance and shorten its useful life. Therefore, effective heat dissipation or conduction must be achieved while adhering to a very small form factor."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "One aspect provides an electronics device. This embodiment comprises a printed circuit board (PCB) and an electronic component mounted to the PCB. A first thermal interface material (TIM) is attached to an upper surface of the electronic component. A heatsink that has a support base and the support base supports the heatsink on the PCB and over the electronic component. At least one biasing member having a first end is in contact with an underside of the heatsink. A thermally conductive plate is in contact with a second end of the biasing member. The thermally conductive plate has a surface area that contacts the first TIM and that is substantially larger than a surface area of the electronic component that contacts the first TIM. The thermally conductive plate is biased from the heatsink. A second TIM is located between the underside of the heatsink and the thermally conductive plate.

"Another embodiment provides a mobile electronics device. This embodiment comprises a housing that has a screen associated therewith and an electronics device. The electronics device comprises a printed circuit board (PCB) and an electronic component mounted to the PCB. A first thermal interface material (TIM) is attached to an upper surface of the electronic component. A heatsink has a support base, and the support base supports the heatsink on the PCB and over the electronic component. At least one biasing member having a first end is in contact with an underside of the heatsink. A thermally conductive plate is in contact with a second end of the biasing member. The thermally conductive plate has a surface area that contacts the first TIM and that is substantially larger than a surface area of the electronic component that contacts the first TIM. The thermally conductive plate is biased from the heatsink. A second TIM is located between the underside of the heatsink and the thermally conductive plate.

"Another embodiment provides a method of manufacturing embodiments of the electronics device, as discussed herein. One embodiment of the method comprises providing a printed circuit board (PCB), mounting an electronic component onto the PCB, attaching a first thermal interface material (TIM) to an upper surface of the electronic component, attaching a second TIM to an underside of a heatsink, and placing a heatsink on the PCB. The heatsink includes a support base that supports the heatsink on the PCB. When placed on the PCB, the heatsink is located over the electronic component. A first end of at least one biasing member contacts an underside of the heatsink, and a thermally conductive plate contacts a second end of the biasing member. The biasing member biases a surface of the thermally conductive plate toward the first TIM. The surface of the thermally conductive plate has a surface area that contacts the first TIM and that is substantially larger than the surface area of the electronic component that contacts the first TIM. A second TIM is located between the underside of the heatsink and the thermally conductive plate."

URL and more information on this patent, see: Haley, David; Galutera, Carlo. Internally Die-Referenced Thermal Transfer Plate. U.S. Patent Number 9775229, filed January 25, 2017, and published online on September 26, 2017. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9775229.PN.&OS=PN/9775229RS=PN/9775229

Keywords for this news article include: Electronics, Circuit Board, Microprocessors, Nvidia Corporation.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2017, NewsRx LLC

(c) 2017 NewsRx LLC, source Technology Newsletters

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