By a News Reporter-Staff News Editor at Defense & Aerospace Week -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Beair, William D. (Carrollton, TX); Williams, Michael R. (Allen, TX); Gilley, Eric (Quinlan, TX), filed on March 14, 2012, was published online on July 8, 2014.
The patent's assignee for patent number 8770462 is Raytheon Company (Waltham, MA).
News editors obtained the following quote from the background information supplied by the inventors: "The subject matter disclosed herein relates to a solder paste transfer process and, more particularly, to a solder paste transfer process for non-planar surface mount assemblies.
"Standard circuit cards are flat and do not have heat sinks, components or connectors attached to them. This allows solder paste to be applied using an automated screen print process. When a circuit card is not flat, however, the automated process cannot be used and the standard alternate process is to dispense solder paste onto the circuit card locations. This process is often very time consuming and has a high potential for causing solder defects.
"Dispensing improvement efforts have included the introduction of the auger positive displacement valve. Auger valves use rotating threads in close proximity to a cylinder wall to force paste downward through a needle tip. These valves rely on fluid pressure to supply a continuous feed of paste into the auger chamber during dispense. Although this can be more precise than time/pressure valves, auger valves usually are more complicated to operate and have a larger degree of variables controlling dispense volume. Dispensing solder paste is also a very labor dependant process increasing assembly cost."
As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "According to one aspect of the invention, a solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
"According to another aspect of the invention, a solder paste transfer tool fixture is provided and includes a fixture body and multiple transfer tools extending from a surface of the fixture body. Each of the multiple transfer tools includes a body and a surface of the body onto which solder paste is applicable and each of the respective surfaces is non-wettable with respect to the solder paste.
"According to yet another aspect of the invention, a system is provided and includes a surface on which multiple solder pad locations are defined and a solder paste transfer tool fixture. The fixture includes a fixture body and multiple transfer tools extending from the fixture body in an arrangement that is reflective of a formation of the multiple solder pad locations. Each of the multiple transfer tools includes a surface onto which solder paste is applicable, and each of the respective surfaces is non-wettable with respect to the solder paste. These and other advantages and features will become more apparent from the following description taken in conjunction with the drawings."
For additional information on this patent, see: Beair, William D.; Williams, Michael R.; Gilley, Eric. Solder Paste Transfer Process. U.S. Patent Number 8770462, filed March 14, 2012, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8770462.PN.&OS=PN/8770462RS=PN/8770462
Keywords for this news article include: Raytheon Company, Aerospace and Defense Companies.
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