Rengo : to Exhibit at Tokyo Pack 2014

Rengo Co., Ltd. (Head Office: Kita-ku, Osaka; Chairman, President & CEO: Kiyoshi Otsubo) announces that it will exhibit at the Tokyo International Packaging Exhibition 2014 (Tokyo Pack 2014) to be held at Tokyo Big Sight starting October 7.

With the booth concept of "The Beginning of the Age of 'L'," Rengo's main display will be based on the theme of "Distribution Revolution" and will introduce new concepts in corrugated packaging that greatly improve shop stocking and display performance, as well as sales promotion towards customers, and packaging systems that drastically improve packaging processes at mail order and distribution bases while saving resources and labor.

Visitors can also view cutting-edge packaging solutions from Rengo, a General Packaging Industry (GPI) that creates high-added value products that use fewer resources based on the concept of "Less is more."