Sony Corporation : Sony and Tokyo Tech Jointly Develop Low-power LSIs for Wideband Millimeter-wave Wireless Communications that Achieves the World’s Fastest*1 Data Transfer Rate of 6.3 Gb/s
02/19/2012| 09:07pm US/Eastern

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In recent years, the demand for ever-increasing wireless
communication speeds has led to a consequential increase in
the need for more frequencies. In particular, the shortage of
frequencies under 6 GHz has become an increasingly critical
issue. Additionally, the amounts of inter-device data
transmission has also quickly risen due to enhancements in
the sound and image quality of audio data, photos, and the
video images used for TV, mobile devices and online
video-sharing services. Such enhancements have driven the
need for the technologies that facilitate the inter-device
transmission of large amounts of data at much higher
speeds.
In order to accommodate these expected future developments,
the Tokyo Institute of Technology and Sony have jointly
developed a millimeter-wave wireless data transfer technology
that realizes both high-speed and low-power data transfer
between mobile devices. Implementation of this technology
will enable users to transmit and receive data at much higher
speeds between mobile devices without the need for cable
connections. This technology will also enable users to enjoy
uncompressed high-quality video streaming from a mobile
device to a display.
In this joint development, Sony was tasked with designing the
digital parts of the BB LSI and the development of the chip
unit as a whole, while the Tokyo Institute of Technology
designed the RF LSI and the analog parts of BB LSI.
The high-efficiency and high-integrity of the rate-14/15
Low-Density Parity-Check (LDPC) error-correcting code*2
developed by Sony significantly decreases the amount of
redundant data that is required for error correction, and
this has enabled LDPC decoding at the world's lowest*3
per-bit energy efficiency of 11.8 pJ/b (74 mW at 6.3 Gb/s).
This LDPC code was proposed to the 60 GHz band
millimeter-wave wireless communication standard IEEE
802.15.3c and employed in the standards.
A research team led by Professor Akira Matsuzawa and
Associate Professor Kenichi Okada at the Tokyo Institute of
Technology has developed an RF LSI that functions as a 60 GHz
band millimeter-wave direct-conversion transceiver*4 capable
of, for the first time ever, the 16 Quadrature Amplitude
Modulation (16QAM)*5 of high-speed wireless communications
for every frequency channel defined under the 60 GHz band
millimeter-wave wireless communication standards*6. This
breakthrough has been achieved by a unique back-to-back
layout structure of the injection locked*7 oscillator. The
analog-to-digital converter (ADC) on the BB LSI achieved the
world's lowest power consumption of 12mW at a sampling rate
of 2.3 G samples/s as an ADC integrated in a 60 GHz wireless
chip by developing a simple comparator which does not
increase the conversion noise.
Part of this R&D was conducted as a part of the "R&D for
Expansion of Radio Wave Resources" sponsored by the Japanese
Ministry of Internal Affairs and Communications (MIC).
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Ce noodl a été diffusé par Sony Corporation et publié initialement sur http://www.sony.net. Il a été distribué par noodls le 2012-02-20 03:00:32 AM sans aucune modification. L’émetteur est seul responsable de l’exactitude des informations fournies.
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