By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Song, Ming-Hsiang (Shin-Chu, TW); Lee, Jam-Wem (Hsinchu, TW); Chang, Yi-Feng (Xinbei, TW); Lin, Wun-Jie (Hsinchu, TW), filed on December 30, 2015, was published online on May 30, 2017.
The assignee for this patent, patent number 9666575, is TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (Hsin-Chu, TW).
Reporters obtained the following quote from the background information supplied by the inventors: "High voltages can develop in the vicinity of an integrated circuit due to the buildup of electrostatic charges. When the electrostatic charges are discharged, a current is produced at nodes of the integrated circuit, thus causing an electrostatic discharge (ESD). During ESD, current flowing through the integrated circuit generates heat."
In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to be an extensive overview of the claimed subject matter, identify key factors or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
"One or more techniques, and resulting structures, for fabricating a semiconductor arrangement are provided herein.
"The following description and annexed drawings set forth certain illustrative aspects and implementations. These are indicative of but a few of the various ways in which one or more aspects are employed. Other aspects, advantages, and/or novel features of the disclosure will become apparent from the following detailed description when considered in conjunction with the annexed drawings."
For more information, see this patent: Song, Ming-Hsiang; Lee, Jam-Wem; Chang, Yi-Feng; Lin, Wun-Jie. Semiconductor Arrangement Facilitating Enhanced Thermo-Conduction. U.S. Patent Number 9666575, filed December 30, 2015, and published online on May 30, 2017. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9666575.PN.&OS=PN/9666575RS=PN/9666575
Keywords for this news article include: Electronics, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED.
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