Damage to wafers in progress remains under assessment, but TSMC's initial estimate is that more than 95 percent of the tools can be fully restored to normal in two to three days. The company is deploying personnel from Hsinchu and Taichung sites to support recovery in Tainan, and does not expect the earthquake to affect first quarter 2016 wafer shipment by more than 1 percent. TSMC will soon notify affected customers and will recover any lost production as soon as possible.
TSMC - Taiwan Semiconductor Manufacturing Company Ltd. issued this content on 06 February 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 06 February 2016 05:46:03 UTC
Original Document: http://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&newsid=THPGHIHITH&language=E