Hsinchu, Taiwan, R.O.C., November 14, 2017 -
TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved capital appropriations of approximately US$4,284.5 million for purposes including: 1) US$1,667.5 million for construction of fab facilities; 2) US$2,617 million for other purposes including: Expanding and upgrading advanced technology capacity; Expanding advanced packaging technology capacity; Expanding specialty technology capacity; Conversion of logic capacity to specialty technology; First quarter 2018 R&D capital investments and sustaining capital expenditures.

2. Approved the capital injection of not more than US$2 billion to TSMC Global Ltd., a wholly-owned BVI subsidiary, for the purpose of reducing foreign exchange hedging costs.

TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 14 November 2017 and is solely responsible for the information contained herein.
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