Hsinchu, Taiwan, R.O.C., Dec. 7, 2017 -
TSMC (TSE: 2330, NYSE: TSM) today held its 17th annual Supply Chain Management forum to show appreciation for the support and contributions of its suppliers in 2017, particularly in 10nm capacity ramp and technology development in 7nm and beyond. Over 600 suppliers around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and services, and environmental and waste management services participated in the forum.

'This is an exciting time of innovation for the semiconductor industry, with new applications for silicon emerging one after another,'said TSMC Co-Chief Executive Officer Dr. Mark Liu. 'TSMC looks forward to even closer collaboration with our supplier partners to enable these innovation and create a better, more intelligent world for the future.'

'With the support of our supplier partners, TSMC has once again brought a new technology to volume production in record time with our 10nm capacity,' said TSMC Senior Vice President and Chief Information Officer Dr. Steve Tso. 'For this, as well as many achievements together throughout 2017, we extend our heartfelt thanks and hope to continue working side by side to drive technology forward.'

Twelve outstanding suppliers were recognized by TSMC for their performance, as follows:

Excellent Performance Award

Equipment:

Applied Materials, Inc. - Technology Collaboration ASM International N.V. - CVD Equipment ASML - Innovation and Collaboration on EUV EBARA Corporation - CMP Equipment Hitachi Kokusai Electric Inc. - Furnace Equipment LAM Research Corporation - Etch Equipment Tokyo Electron Limited - Production Ramp Support Material:

Fujifilm Electronic Materials Co., Ltd. - CMP Material HOYA Corporation - Mask Blank Material
Shin-Etsu Hantodai Co., Ltd. - Raw Wafer Material SUMCO Corporation - Raw Wafer Material
Tokyo Ohka Kogyo - Lithography Material

TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 07 December 2017 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 07 December 2017 07:01:05 UTC.

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