Member access

4-Traders Homepage  >  Shares  >  TAIWAN STOCK EXCHANGE  >  United Microelectronics Corp.    2303   TW0002303005

SummaryNewsCalendarCompanyFinancialsConsensusRevisions 

United Microelectronics Corp. : United Microelectronics Raises NT$10 Billion In Bond Offering

05/09/2012 | 09:44pm US/Eastern
Recommend:
0

United Microelectronics Corp. (2303.TW) raised NT$10 billion (US$340 million) via a bond sale, the company said Thursday.

UMC, the world's second-largest contract chip manufacturer by revenue after Taiwan Semiconductor Manufacturing Co., said it sold NT$7.5 billion of five-year bonds priced at par to yield 1.43%, and NT$2.5 billion seven-year bonds at par to yield 1.63%.

-By Fanny Liu, Dow Jones Newswires; +886 25022557; fanny.liu@dowjones.com

Recommend :
0
React to this article
Latest news on UNITED MICROELECTRONICS CO
2d ago UNITED MICROELECTRONICS : Patent Issued for Method for Supporting Semiconductor ..
2d ago UNITED MICROELECTRONICS : Patent Issued for Image Sensor and Method for Fabricat..
2d ago UNITED MICROELECTRONICS : Patent Issued for Method of Optical Proximity Correcti..
2d ago UNITED MICROELECTRONICS : Patent Issued for Method for Inspecting Photo-Mask
2d ago UNITED MICROELECTRONICS : Patent Issued for Image Sensor Including a Deep Trench..
07/18DJFujitsu in Talks With Taiwan's UMC For JV
07/17 Fujitsu to end chip production, sell plants to Taiwan, U.S. firms
07/16 UNITED MICROELECTRONICS : Researchers Submit Patent Application, "Electrostatic ..
07/16 UNITED MICROELECTRONICS : Patent Issued for Anti-Fuse Structure and Anti-Fuse Pr..
07/16 UNITED MICROELECTRONICS : "Semiconductor Structure and Method of Fabricating Mos..
Advertisement
Dynamic quotes  
ON
| OFF