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United Microelectronics Corp. : United Microelectronics Raises NT$10 Billion In Bond Offering

05/09/2012 | 10:44pm US/Eastern

United Microelectronics Corp. (2303.TW) raised NT$10 billion (US$340 million) via a bond sale, the company said Thursday.

UMC, the world's second-largest contract chip manufacturer by revenue after Taiwan Semiconductor Manufacturing Co., said it sold NT$7.5 billion of five-year bonds priced at par to yield 1.43%, and NT$2.5 billion seven-year bonds at par to yield 1.63%.

-By Fanny Liu, Dow Jones Newswires; +886 25022557; fanny.liu@dowjones.com

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