Veeco Instruments : Announces Date for Fourth Quarter and Year-End 2015 Financial Results and Conference Call
February 04, 2016 at 04:57 pm EST
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February 02, 2016
PLAINVIEW, NY--(Marketwired - February 02, 2016) - Veeco Instruments Inc. (NASDAQ: VECO) plans to release its fourth quarter and year-end 2015 financial results after the market close on Monday, February 22, 2016. The company will host a conference call to review these results starting at 5:00pm ET that day.
To join the call, dial 1-888-438-5491 (toll free) or 1-917-785-1765 and use passcode 4400150. Participants may also access a live webcast of the call by visiting the investor relations section of Veeco's website at ir.veeco.com. A replay of the webcast will be made available on the Veeco website beginning at 8:00pm ET that same evening.
About Veeco
Veeco's process equipment solutions enable the manufacture of LEDs, displays, power electronics, compound semiconductors, hard disk drives, semiconductors, MEMS and wireless chips. We are the leader in MOCVD, MBE, Ion Beam, Wet Etch single wafer processing and other advanced thin film process technologies. Our high performance systems drive innovation in energy efficiency, consumer electronics and network storage and allow our customers to maximize productivity and achieve lower cost of ownership. For information on our company, products and worldwide service and support, please visit www.veeco.com.
Veeco Instruments Inc. issued this content on 02 February 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 04 February 2016 21:56:31 UTC
Original Document: http://www.veeco.com/company/news/veeco-announces-date-for-fourth-quarter-and-year-end-2015-financial-results-and-conference-call
Veeco Instruments Inc. is a manufacturer of semiconductor process equipment. The Company's laser annealing, ion beam, chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), single wafer etch and clean and lithography technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. The Company's system products include Laser Annealing Systems, Ion Beam Systems and Etch Systems, Advanced Packaging Lithography, Single Wafer Wet Processing, Metal Organic Chemical Vapor Deposition Systems, Molecular Beam Epitaxy Systems, Atomic Layer Deposition Systems, and Other Systems. Its other deposition systems include Physical Vapor Deposition, Diamond-Like Carbon Deposition, and Chemical Vapor Deposition Systems. Its process equipment systems are used in the production of a range of microelectronic components, including logic, dynamic random-access memory (DRAM), photonics devices, power electronics, and other semiconductor devices.