Materials, Inc. (NYSE: VSM), a leading global materials supplier to
the semiconductor industry, announced today that it will participate in
(Atomic Layer Deposition) Conference taking place July 15-18, 2017
at the Sheraton Downtown Denver in Denver, Colorado as a platinum
sponsor. The event is dedicated to the science and technology of atomic
layer controlled deposition of thin films and topics related to atomic
Representatives from Versum Materials will exhibit the company’s
organosilanes and organometallics offerings and its innovative VMLaunch™
Program, which has introduced over 400 different chemistries in more
than 100 unique containers for customers seeking high-purity electronic
grade materials tailored to their application needs. The company’s
expertise in precursor chemistry has translated into a history of
innovation that provides the semiconductor industry with new molecules,
unique configurations, and product scale-up roadmaps.
“Through the VMLaunch Program, our team closely works with our customers
to provide the chemistry, grade, container, and analytical services that
they need to supply chemistries that are either internally-synthesized
or externally-sourced to fulfill any customized specification with lead
times that fulfill rapidly moving new developments,” stated Suresh
Rajaraman, Business Marketing Manager—Advanced Materials at Versum
Additionally, technical experts from Versum Materials will participate
in the following presentations during the event:
“Atomic Layer Deposition of Carbon Doped Silicon Oxide by Precursor
Design and Process Tuning” on Sunday, July 16, 2017, at 2:00 p.m.
“In situ Infrared Absorption Study of Plasma-Enhanced ALD of Silicon
Nitride using Di-sec-butylaminosilane and Bis(t-butylamino)silane on
Silicon and Silicon Nitride Surfaces” on Sunday, July 16, 2017 at 2:45
“Deposition of Tungsten Carbide and Tungsten Nitride Films from
Halogen-Free Tungsten Precursors” on Sunday, July 16, 2017, at 5:30
“Novel Approach to Deposit Carbon Doped Silicon Oxide Film with High
Carbon Content via Thermal ALD” on Monday, July 17, 2017, at 5:30 p.m.
“Plasma Enhanced ALD of BN, B-doped SiN and B-doped TiN” on Monday,
July 17, 2017, at 5:30 p.m.
“Leveraging Atomistic Modeling for Insights into Nucleation of Cobalt
Precursors on Various Substrates” on Monday, July 17, 2017, at 5:30
For more information about Versum Materials, please visit www.versummaterials.com.
About Versum Materials
Versum Materials, Inc. (NYSE: VSM) is a leading electronic materials
company providing high-purity chemicals and gases, delivery systems,
services and materials expertise to meet the evolving needs of the
global semiconductor and display industries. Derived from the Latin word
for “toward,” the name “Versum” communicates the company’s deep
commitment to helping customers move toward the future by collaborating,
innovating and creating cutting-edge solutions.
A global leader in technology, quality, safety and reliability, Versum
Materials is one of the world’s leading suppliers of next-generation CMP
slurries, ultrathin dielectric and metal film precursors, formulated
cleans and etching products, and delivery equipment that has
revolutionized the semiconductor industry. Versum Materials has annual
sales of approximately $1 billion, 2,000 employees and 10 major
facilities in Asia and North America. It is headquartered in Tempe,
Arizona. Prior to its separation on October 1, 2016, Versum
Materials had operated for more than three decades as a division of Air
Products and Chemicals, Inc. (NYSE: APD).
For additional information, please visit http://www.versummaterials.com.
Nahla A. Azmy, 610-481-7499
Tiffany Zinn, 480-282-6475
The Versum Materials logo and Versum are registered trademarks of Versum
Materials, Inc. or its affiliates. VMLaunch is a registered trademark of
Versum Materials, Inc. or its affiliates.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170712006102/en/