Ling Man Pan
Director/Board Member at Shenzhen Cau Technology Co. Ltd. /Shenzhen/
Profile
Ling Man Pan currently holds a position as an Independent Director at Shenzhen Cau Technology Co. Ltd.
In the past, Ms. Pan has held positions as an Independent Director at Shenzhen Coship Electronics Co., Ltd., Shenzhen Salubris Pharmaceuticals Co., Ltd., and Shenzhen Danbond Technology Co., Ltd.
Ms. Pan also served as an Independent Director at Shenzhen Wote Advanced Materials Co., Ltd.
from 2018 to 2021.
Ms. Pan has a Master's in Business Administration from Renmin University of China and an undergraduate degree from Wuhan Finance School, which was conferred in 1968.
Ling Man Pan active positions
| Companies | Position | Start |
|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Director/Board Member | 2011-01-31 |
Former positions of Ling Man Pan
| Companies | Position | End |
|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Director/Board Member | 2021-04-08 |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Director/Board Member | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Director/Board Member | - |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Director/Board Member | - |
Training of Ling Man Pan
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Listed companies | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Private companies | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
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