Duiven, the Netherlands, September 1, 2015 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of orders aggregating approximately USD 7 million for 8 thermo compression bonders ("TCB") from a large North American semiconductor producer. The recent TCB order is part of a larger program for which Besi has received to date over 30 TCB orders for non-volatile memory applications.
Richard Blickman, Chief Executive Officer of the Company, commented: "We are very pleased to receive these important orders after demonstrating superior and consistent bonding results. We believe that such orders reflect our leadership position in the emerging TCB interconnect technology with systems featuring the highest throughput, lowest cost of ownership and most compact design."
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