GREATEK ELECTRONICS INC. |
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|
5-day change | 1st Jan Change | ||
| 62.8 TWD | +0.32% |
|
+0.64% | +2.61% |
Days
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-40%
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| Sales 2022 | 15.95B 496M | Sales 2023 | 13.57B 422M | Capitalization | 34.81B 1.08B |
|---|---|---|---|---|---|
| Net income 2022 | 3.16B 98.19M | Net income 2023 | 2B 62.09M | EV / Sales 2022 | 1.47 x |
| Net cash position 2022 | 3.87B 120M | Net cash position 2023 | 4.74B 147M | EV / Sales 2023 | 2.22 x |
| P/E ratio 2022 |
8.82
x | P/E ratio 2023 |
17.6
x | Employees | 4,211 |
| Yield 2022 |
7.71% | Yield 2023 |
4.08% | Free-Float | 49.95% |
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| 1 day | +0.32% | ||
| 1 week | +0.64% | ||
| Current month | +2.95% | ||
| 1 month | +2.61% | ||
| 3 months | +3.97% | ||
| 6 months | +7.72% | ||
| Current year | +2.61% |
1 week
61.80
63.00
1 month
58.5063.50
Current year
57.5067.10
1 year
54.0067.10
3 years
44.6599.50
5 years
33.9099.50
10 years
24.0599.50
| Managers | Title | Age | Since |
|---|---|---|---|
Chien Chao Ning
CEO | Chief Executive Officer | - | 95-11-17 |
Sheng Chen
DFI | Director of Finance/CFO | - | 11-06-30 |
Yung Ta Hsieh
CHM | Chairman | 66 | 12-04-02 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Tu Kung Tsai
BRD | Director/Board Member | 73 | 12-04-02 |
Chien Chao Ning
CEO | Chief Executive Officer | - | 95-11-17 |
Chu Chien Feng
BRD | Director/Board Member | - | 15-06-09 |
| Name | Weight | AuM | 1st Jan change | Investor Rating |
|---|---|---|---|---|
| 0.01% | 4 M€ | -4.41% | - | |
| 0.01% | 112 M€ | +5.41% | - | |
| 0.00% | 7 M€ | +6.58% | - |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-05-17 | 62.8 | +0.32% | 663,344 |
| 24-05-16 | 62.6 | +0.48% | 1,079,120 |
| 24-05-15 | 62.3 | +0.65% | 676,157 |
| 24-05-14 | 61.9 | -0.48% | 498,278 |
| 24-05-13 | 62.2 | -0.32% | 539,184 |
End-of-day quote Taiwan S.E., May 16, 2024
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GREATEK ELECTRONICS INC. is a Taiwan-basd company principally engaged in the provision of integrated circuit (IC) packaging and testing services. The Companyâs packaging products mainly include traditional leadframe package, quad flat no-lead package, solder ball array packages, flip-chip packages and 8-wafer-level advanced packages. The Company's testing services include wafer testing and finished product testing services. The Company conducts its businesses in Taiwan, the Americas, Hongkong, Europe and the rest of Asia.
Sector
Semiconductors
Calendar
May. 02
- Q1 2024 Earnings Release
| 1st Jan change | Capi. | |
|---|---|---|
| +2.61% | 1.11B | |
| +86.74% | 2,275B | |
| +40.81% | 673B | |
| +25.00% | 647B | |
| +11.57% | 266B | |
| +34.04% | 216B | |
| +14.41% | 178B | |
| +46.81% | 139B | |
| -36.62% | 135B | |
| +46.85% | 115B |
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