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4-Traders Homepage  >  Equities  >  Nasdaq  >  Cadence Design Systems Inc    CDNS

Delayed Quote. Delayed  - 07/26 10:00:00 pm
24.26 USD   -7.16%
07/26 CADENCE DESIGN : Launches Tensilica Fusion G3 DSP Featuring Excepti..
07/25 CADENCE DESIGN : beats Street 2Q forecasts
07/25 CADENCE DESIGN : Reports Second Quarter 2016 Financial Results
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Cadence Design Systems : Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications

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07/26/2016 | 04:46pm CEST

SAN JOSE, Calif., July 26, 2016 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the new Cadence® Tensilica® Fusion G3 digital signal processor (DSP), a multi-purpose, high-performance DSP ideal for compute-intensive system-on-chip (SoC) designs. The Tensilica Fusion G3 DSP is exceptionally easy to program and ideal for use in automotive, consumer, internet-of-things (IoT) and industrial applications that combine intensive audio, imaging, communications, radar and embedded DSP computation. For more information, visit: cadence.com/go/FusionG3.

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"As we continue to broaden our customer base, we are solving a wider range of SoC challenges. The flexibility of the new Tensilica Fusion G3 DSP is perfect for customers running a diverse set of software applications," stated Steve Roddy, senior group director of product marketing for Tensilica in the IP Group at Cadence. "With advanced development tools including auto-vectorization and extensive library support, the Tensilica Fusion G3 DSP provides our customers with an easy development flow and higher performance out-of-the-box for their next-generation applications. Even those with extensive floating-point performance requirements can quickly port existing code to the Tensilica Fusion G3 DSP with the optional Vector Floating-Point unit."

The Tensilica Fusion G3 DSP expands on the multi-purpose Tensilica Fusion DSP product family introduced in 2015. When compared to the Tensilica Fusion F1 DSP, the Fusion G3 DSP shares the same base Xtensa instruction-set architecture (ISA), while adding richer and higher throughput DSP instructions. Ideal for more compute-intensive applications including radar, imaging and mid- to high-end audio pre/post-processing, it delivers this performance with quad 32-bit integer MACs and quad single-precision 32-bit floating-point MACs.

"Cadence has long supplied function-specific DSPs for audio, imaging/vision and baseband signal-processing workloads. In fast-evolving markets like automotive and IOT, however, where DSP requirements are known to be changing, a narrowly-focused DSP is not always the best choice," said Mike Demler, senior analyst of The Linley Group. "In these markets, there is an emerging demand for high performance, multi-purpose DSP IP which supports a wider range of data types and operations, including both fixed and floating point. A single, extensive, DSP instruction set architecture (ISA) that handles many different compute-intensive signal processing tasks, can future-proof SOC designs in fast changing markets."

Combining high-performance signal processing with configurability and extensibility allows significant customer flexibility in hardware and software design choices. The Tensilica Fusion G3 DSP was co-designed with a lead customer and has already been taped out in silicon earlier this year. The Fusion G3 DSP will be available for broad licensing in October 2016.

Tensilica processors have been licensed by 17 of the top 20 semiconductor vendors, have over 250 licensees, with 1000s of different cores in silicon. The Xtensa architecture is one of the most popular licensable processor architectures, shipping over 3B cores in 2015, in products spanning sensors to supercomputers.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.

This press release contains certain forward-looking statements that are based on our current expectations and involve numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Risks that may cause these forward-looking statements to be inaccurate include, among others, the risks detailed from time-to-time in our U.S. Securities and Exchange Commission filings and reports, including but not limited to, our most recent quarterly report on Form 10-Q and our annual report on Form 10-K. We do not intend to update the information contained in this press release.

© 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective holders.

For more information, please contact:
Cadence Newsroom
408-944-7039
newsroom@cadence.com

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To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/cadence-launches-tensilica-fusion-g3-dsp-featuring-exceptional-out-of-the-box-performance-for-compute-intensive-signal-processing-applications-300303822.html

SOURCE Cadence Design Systems, Inc.

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Financials ($)
Sales 2016 1 824 M
EBIT 2016 478 M
Net income 2016 241 M
Debt 2016 -
Yield 2016 -
P/E ratio 2016 34,29
P/E ratio 2017 28,22
Capi. / Sales 2016 4,31x
Capi. / Sales 2017 4,07x
Capitalization 7 862 M
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Mean consensus OUTPERFORM
Number of Analysts 8
Average target price 25,4 $
Spread / Average Target -2,7%
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NameTitle
Lip-Bu Tan President, Chief Executive Officer & Director
John B. Shoven Chairman
Geoffrey G. Ribar Chief Financial Officer & Senior Vice President
Neil Kole Chief Information Officer & SVP
Roger S. Siboni Independent Director
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