Introducing our new CM300xi, with Contact Intelligence technology, that is designed to meet the measurement challenges brought on by extremely complex environments. CM300xi adapts to temperature variance and provides automated drift correction for unattended testing on small pads over time and temperature. The CM300xi provides the lab automation capabilities needed to make critical precision electrical measurements for device characterization, high volume engineering and extremely challenging applications. It is also ideally suited in customized solutions, niche production applications, and emerging markets. The CM300xi raises the performance bar with new high thermal stability (HTS) capabilities, enhanced soak time management enabled by the Velox™ probe station control software, as well as the VueTrack™ on-site PTPA technology. The result is the most accurate, flexible and scalable engineering probe system in the semiconductor lab.

The CM300xi offers measurement accuracy and reliability in a probe solution that is completely modular - whether it's I-V/C-V, RTN and RF measurements in one semi-automated system, or a fully-automated dual-prober system that handles any combination of 200 mm and 300 mm wafers. Using VeloxPro™ test automation software, the CM300xi enables safe and fast wafer loading and easy test automation and measurement system integration, while preventing damage of probe tips and probe cards throughout the entire measurement cycle.

With our precision measurement expertise, you can confidently deliver accurate and reliable data for current and evolving device technologies. The CM300xi provides faster lifetime predictability in the reliability process, and less design iterations in the modeling process.

Here are some additional features and benefits worth noting:

  • Modular design allows for scalability from semi-automated operation to fully-automated prober or dual-prober system
  • High accuracy and repeatability means superior low-leakage and low-noise measurements, along with safe and accurate hands-off testing
  • Automated testing helps enable unattended tests on small pads. In addition, thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C*
  • Improved test productivity means faster delivery of a wide range of precise model parameters to enhance process and device development
  • Better flexibility delivers DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug in a full thermal range of -60°C to +300°C*
  • Contact Intelligencetechnology enables CM300xi to sense, learn and react to multiple temperatures and small pad layouts, providing the most accurate probe to pad alignment

Download our CM300xi product data sheet here or visit our website to learn more.

*The actual +/- temperature range varies depending on pad size, probe card holder, probe card, as well as the customer´s test execution.

Cascade Microtech Inc. published this content on 29 September 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 29 September 2016 21:20:01 UTC.

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