SUNNYVALE, CA -- (Marketwired) -- 06/08/16 -- QuickLogic Corporation (NASDAQ: QUIK) -
- QuickLogic has completed its production qualification for the new EOS S3 ultra-low power sensor processing SoC
- The EOS S3 SoC platform enables advanced sensor processing applications for smartphone, wearables & IoT applications with substantially lower power consumption than traditional MCU solutions
- Initial tier-one customer shipments are scheduled for late June
QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable sensor processing solutions, announced today that production qualification testing for its new EOS™ S3 sensor processing SoC has been completed successfully. Initial shipments to support pre-production requirements for a tier-one customer are scheduled for later this month.
The EOS S3 sensor processing platform is a multi-core SoC that enables a vast array of concurrent sensor applications, from basic to computationally demanding algorithms for smartphone, wearable, and Internet of Things (IoT) devices. Unlike traditional MCU-based solutions, the EOS S3 sensor processing platform enables sophisticated algorithm partitioning to facilitate the lowest possible power consumption for a designated task.
Advanced sensor algorithms such as voice triggering, motion compensated heart rate monitoring, and indoor navigation can be implemented at significantly lower levels of power consumption than competing MCU-based solutions. Low power consumption enables OEMs to dramatically extend battery life for advanced applications, and with that, significantly enhance the user experience.
'The EOS S3 employs always-on, context-aware sensing capabilities while staying well within the strict power budgets of smartphone, wearable, and IoT designs,' said Brian Faith, vice president of worldwide marketing at QuickLogic Corporation. 'Now that this leading edge platform has been production qualified, the top-tier OEMs we've been working with know that they can reliably scale up their manufacturing to high-volume production levels.'
Key Features
Feature | Details | ||
Processor Cores |
- 578 KB of aggregate SRAM for code and data storage | ||
QuickLogic Proprietary microDSP Flexible Fusion Engine | - 50 KB SRAM for code | ||
- 16 KB SRAM for data | |||
- Very Long Instruction Word (VLIW) | |||
microDSP architecture | |||
- 30 microWatts/MHz | |||
ARM Cortex M4F | - Up to 80 MHz | ||
- Up to 512 KB SRAM | |||
- 32-Bit, includes Floating Point Unit | |||
- 75 microWatts/MHz | |||
Programmable Logic | - 2,800 Effective logic cells | ||
Integrated Voice | - Always-On Voice Trigger and Integrated | ||
Phrase Recognition Capability, based on | |||
Sensory TrulyHandsFree® technology | |||
- Integrated I2S and PDM microphone input | |||
with support for mono and stereo | |||
configurations | |||
- Integrated PDM to PCM conversion | |||
- Integrated Sensory Low Power Sound | |||
Detector (LPSD) | |||
- Optional PDM bypass mode to directly | |||
drive application processor or CODEC | |||
Interface Support | |||
To Host | - Integrated SPI Slave | ||
To Sensors and Peripherals | - Integrated SPI Master (2X), I2C, UART | ||
To Microphones | - Integrated PDM and I2S |
Additional Components | |||
ADC | - Integrated 12-Bit Sigma Delta | ||
Regulator |
- Integrated Low Drop Out (LDO), with 1.8 to 3.6 V input support | ||
System Clock |
- Integrated 32 kHz and High Speed Oscillator | ||
Package Configurations | |||
Ball Grid Array (BGA) |
- 3.5 x 3.5 mm x 0.7 mm, 0.40 mm ball pitch, | ||
- 64-ball, 46 user I/O's | |||
Wafer Level Chip Scale Package (WLCSP) |
- 2.7 x 2.4 mm x 0.6 mm, 0.35 mm ball pitch, | ||
- 42-ball, 27 user I/O's | |||
Development Environment |
- Industry Standard, IAR and Eclipse IDE Plugin | ||
Software Support |
- Supports Android Lollipop and Marshmallow operating systems | ||
Availability:
QuickLogic's EOS S3 Sensor Processing SoC and design tools are available now. For additional information, please visit www.quicklogic.com/platforms/sensor-processing/eos/
About QuickLogic
QuickLogic Corporation (NASDAQ: QUIK) is a semiconductor provider of ultra-low power, comprehensive, flexible sensor processing solutions enabling significantly longer battery life for the Smartphone, Wearable, and IoT markets. We are the only company integrating multi-core processing, programmable logic, sensor fusion and context aware algorithms, and embedded software. QuickLogic accelerates the pace of innovation for always-on motion, light, environmental, location, and voice-enabled user experiences. For more information about QuickLogic, visit www.quicklogic.com.
The QuickLogic logo and QuickLogic are registered trademarks and EOS is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.
Code: QUIK-G
Contact:Andrea Vedanayagam
Veda Communications
(408) 656-4494
Email Contact
Source: QuickLogic Corporation
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QuickLogic Corporation published this content on 08 June 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 08 June 2016 12:44:04 UTC.
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