Cascade Microtech : Join us and FormFactor at SEMICON China – 3/12 Through 3/14

Join FormFactor and Cascade Microtech March 14 through the 16 at SEMICON China. The event will be at the Shanghai New International Expo Center located in Shanghai, China and we'll be in Hall 2 at Booth 2343. We will be demonstrating and showcasing a number of products and solutions. Here's a summary of what you'll see:

Fully-integrated Wafer Measurement Solution for Full-Thermal WR3.4 mmW Probing - We are the first in the industry to eliminate the need for the Waveguide extensions, reducing loss, mismatch and the potential for expansion related drift. At SEMICON, we will showcase an idealized setup with a single flange between the probe tip and the frequency extender fully covering tests on heated as well as on cooled wafers. It is one of the first stations to significantly shorten the signal path by taking advantage of the reduced volume of the latest frequency extender modules, achieving accurate over-temperature tests at mmW/sub-mmW frequencies. The system also enables fully-automatic multiline thru-reflect-line calibration with motorized programmable positioners, increasing measurement accuracy and repeatability and reducing test time. You'll also see:

• 330 GHz on-wafer probes (T-Wave®)
• Automatic calibration with high accuracy (WinCal XE™)
• Precise probe positioning with programmable positioners
• Compatible with Keysight Technologies analyzers and measurement software
• Single flange between the probe tip and the frequency extender

Production Probe Cards - We'll be displaying a wide variety of probe cards as part of show case. You'll see:

• Parametric Probe Cards - Designed to enable the accurate monitoring of the most advanced parametric test structures, the Parametric series Pyramid Probe® card is compatible with all major parametric tester platforms. Our Takumi™ probe cards for in-line and end-of-line parametric testing give IC manufacturers earlier insight into opportunities to validate their designs, verify process performance and achieve higher yields.
• SoC (WLCSP, Grid Array, Optical IC, Wire Bond) - See the industry's broadest portfolio of non-memory wafer test probe cards offering high parallelism for greater throughput, stable contact resistance for optimal test yield, and superior contact precision.
• DRAM - Testing the new, high-performance, high-density DRAM devices is optimized with our Matrix and PH-Series wafer probe cards as they improve efficiency and reduce the overall cost of DRAM test.
• Flash - Fluctuating price and demand routinely require Flash memory manufacturers to find new operating efficiencies. Our advanced wafer test solutions help manufacturers address that pressure, by improving yield and reducing overall cost of test per die.
• High Frequency (up to 81 GHz) - For robust, lower cost and long-life production testing of 57 GHz to 81 GHz RFICs, the Pyramid-MW Probe is the world's only mm-wave (mmW) RF production probe card that ensures reliable and repeatable measurement results critical for high-yield testing.

Application-Focused Probing Solutions - We'll have an actual probe station in the booth, demonstrating RF on one side and DC and IV/CV on the other side. You'll see many of the features here, including:

• Pre-configured packages for specific applications:
  • DC parametric test down to pA levels
  • IV/C-V measurements down to fA levels
  • RF measurements and calibration up to 67 GHz
  • mmW/THz and load pull applications
  • Failure analysis and design debug
  • High-power device characterization
• Educational Savings Program, financing options, global service, support, installation and training available

High-Power Chuck with MicroVac™ Technology - Come see an actual chuck assembly and see showcase features, such as:

• Accurate on-wafer IGBT/Power MOSFET (GaN, SiC, Si) Characterization
• Thinned and Tyco wafer handling capability
• Up to 10 kV / 600 A
• Gold (Au) plated, flat chuck surface
• Wide temperature range (-55℃ to 300℃)

The Largest Selection of Engineering Probes in the Industry, including those for use:

• From DC to THz range
• High-power capabilities - Up to 10 kV / 600 A
• Low contact resistance
• Small pad probing down to 25x35um
• Mixed-signal multi-contact probes

We'll also have many of our partners along with us, including Keysight, Maury, GBIT, EOULU, and Hi Sun Test, so be sure to come by and say hello. Once again, we'll be at the Shanghai New International Expo Center located in Shanghai, China in Hall 2 at Booth 2343.

-

Photo credit: SEMICON China.