Enplas Corporation ("Enplas", head office: Saitama, president: Daisuke Yokota) hereby announces that Enplas has resolved to construct new building in Omiya-ku, Saitama City, Saitama. Construction is set to commence in October 2024, with completion slated for August 2026.
1. Purpose of Construction of New Building
We commit to keep creating valuable products that delight our customers. This is essential to achieve our corporate philosophy through enhancement of our corporate value. New building will be the core center of R&D to accelerate processes from identifying customer issues to valuable proposal for solving them.
We aim to establish a work environment that puts safety and security first, boosts productivity and supports diverse work styles.
2. Summary of New Building
Location
1-606-2,Kitabukuro-cho,Omiya-ku, Saitama City, Saitama
Usage
R&D center and office
Area
Site area:8,348 square meters, Total floor area:13,500 square meters
Building structure (plan)
1 Building (5 floors above ground and 2 floors as tower building unit)
Investment amount
About 15 billion yen (Consumption tax excluded, Cash on hands is set to be
allocated)
Schedule (plan)
Commencement: October 2024, Completion: August 2026
3. Future Outlook
This change has had a negligible impact on the results for the fiscal year ending March 2025.
However,
if an event which requires disclosure arises, Enplas will promptly announce it.
Notice:
This announcement contains forward-looking statements. These forward-looking statements are based on Enplas's current assumptions, expectations and beliefs in light of the information currently possessed by it and involve known and unknown risks, uncertainties and other factors. Such risks, uncertainties and other factors may cause Enplas's actual results, financial position or cash flows to be materially different from any future results, financial position or cash flows expressed or implied by these forward-looking statements. These risks, uncertainties and other factors referred to above include, but are not limited to, those contained in Enplas's latest Annual Securities Report and Quarterly Securities Report, and Enplas undertakes no obligation to publicly update or revise any forward-looking statements.
The official version of this announcement was published in Japanese. An unofficial English translation is provided for the convenience of overseas investors. For any discrepancies between the Japanese and English versions, the Japanese version shall prevail.
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Enplas Corporation published this content on
30 April 2024 and is solely responsible for the information contained therein. Distributed by
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30 April 2024 06:45:54 UTC.
ENPLAS CORPORATION is mainly engaged in the manufacture, processing and sale of various products made of engineering plastics and composite materials. The Company operates in three business segments. The Engineering Plastic segment manufactures and sells mechanical products used for high-precision gear-based office automation (OA) and telecommunications devices, among others. The Semiconductor Equipment segment offers integrated circuit (IC) sockets and others. The Optical segment offers optical communication devices and light-emitting diode (LED). The others business engages in the research and development related to the Company's businesses.
ENPLAS CORPORATION 
