2017年３月期

Financial Report for Fiscal Year決算Ended説明March資料31, 2023

JAPAN PURE CHEMICAL CO.,LTD.

Securities Code: 4973

証券コード：4973

July 25, 2022

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Glossary(1) （Plating Method）

Term

Applications

Explanation

Electrolytic

-

Plating method on metal surfaces with

plating

electric current

Pure gold

Printed circuit boards

High-purity gold plating

plating

Semiconductor substrates

Hard gold

Connectors

Gold plating that is hardened with alloy

plating

Printed circuit boards

components

Palladium(Pd)

Lead frames

Used as an undercoat for gold plating.

plating

Connectors

PPF stands for Pre Plated Lead frame.

Electroless

-

Plating method by chemical reaction without

plating

electric current

Immersion

Plating method for forming by replacing

Printed circuit boards

metal on surface by utilizing Solubility

plating

(Ionization tendency) of each metal

Auto catalytic

Plating method capable of forming thick

Printed circuit boards

coatings by utilizing chemical reaction with

plating

reducing agent

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Glossary(2) （Plating Process）

Term

Explanation

Composition of

plating

ENIG

Stands for Electroless Nickel Immersion Gold.

Composition of plating is Cu-Ni-Au.

Stands for Electroless Nickel Electroless Palladium

ENEPIG

Immersion Gold.

Composition of plating is Cu-Ni-Pd-Au.

Stands for Direct Immersion Gold. Since Ni plating is

DIG

omitted, it can be used for fine pitch compared to

ENIG. Composition of plating is Cu-Au.

EPIG

Stands for Electroless Palladium Immersion Gold.

Composition of plating is Cu-Pd-Au.

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Product Lineup ～ Lineup Expansion and New Field Development ～

Plating Methods

Applications

Product Lineup

plating

Pure gold

1. Pure gold plating enabling uniform coating even on rough surfaces

2. Pure gold plating with higher hardness

Electrolytic

Hard gold

Gold saving hard gold plating for micro connectors: OROBRIGHT BAR7

（Alloy）

Palladium

Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2

(Pd)

plating

Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X

Immersion gold

Immersion gold plating with less Ni corrosion: IM-GOLD CN

Immersion gold plating without Ni plating: IM-GOLD PC

Electroless

Auto catalytic

Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD

palladium

Direct auto catalytic palladium plating: NEO PALLABRIGHT DP

gold

Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN

Auto catalytic

Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2

New fields

Base metals (copper, tin, nickel)

Alloy plating

Post-treatment agent

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Financial Review for 1Q of FY2022 (1)

Electronic Components Industry

  • Sales in the electronic components industry were strong overall, supported by 5-G compatible smartphones and high-speed telecommunications infrastructure, data center expansion, industrial infrastructure, and IoT device demand for the digital transformation of factories and medical facilities.
  • There was a softening trend in some electronic devices, such as computers and tablets, due to a reactionary decline in demand to stay at home and inventory adjustments.
  • As for automotive electronic components, demand increased with the increase in the number of electronic components and semiconductors installed per vehicle due to increasing electrification in automobiles. However, the severe situation continued due to a supply-demand crunch in semiconductors and COVID-19 in China, which caused shortages in the supply of parts and had a significant impact on the production side of the automobile industry.

JPC's Financial Review

  • Sales of plating chemicals for printed circuit boards and semiconductor substrates were strong due to demand for use in 5G-compatible smartphones and data centers.
  • Sales of plating chemicals for connectors were affected by reduced production for some automobiles, while sales for 5G-compatible smartphones remained strong.
  • Sales of plating chemicals for lead frames decreased only slightly thanks to strong demand for IoT devices, despite the impact of activity restrictions in China and the drop in palladium prices.

Copyright © JAPAN PURE CHEMICAL CO.,LTD. All rights reserved. May not be copied or reprinted without prior written approval.

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JPC - Japan Pure Chemical Co. Ltd. published this content on 25 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 05:25:05 UTC.