Xintec Inc. Provides Earnings Guidance for the Fourth Quarter and Full Year of 2018

Xintec Inc. is principally engaged in the provision of wafer level packaging services. The Company primarily provides wafer level chip scale packaging and wafer level post passivation interconnection services for imaging sensors, biometric sensors, micromotors and power control components, which are applied in the manufacture of camera phones, personal computer (PC) cameras, toy cameras, security monitors, video telephones and personal digital assistants (PDAs), among others. The Company operates its businesses in domestic and overseas markets, such as the rest of Asia, Europe and North America.